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1. WO2020008734 - ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RESIN

Publication Number WO/2020/008734
Publication Date 09.01.2020
International Application No. PCT/JP2019/019333
International Filing Date 15.05.2019
IPC
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
26
Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
06
by a heterocyclic ring containing nitrogen
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
G03F 7/039 (2006.01)
C08F 26/06 (2006.01)
G03F 7/038 (2006.01)
G03F 7/20 (2006.01)
CPC
C08F 26/06
G03F 7/038
G03F 7/039
G03F 7/20
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors
  • 浅川 大輔 ASAKAWA Daisuke; JP
  • 後藤 研由 GOTO Akiyoshi; JP
  • 小島 雅史 KOJIMA Masafumi; JP
  • 川島 敬史 KAWASHIMA Takashi; JP
  • 大石 康史 OISHI Yasufumi; JP
  • 加藤 啓太 KATO Keita; JP
Agents
  • 中島 順子 NAKASHIMA Junko; JP
  • 米倉 潤造 YONEKURA Junzo; JP
  • 藤森 義真 FUJIMORI Yoshinao; JP
Priority Data
2018-12891606.07.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RESIN
(FR) COMPOSITION DE RÉSINE SENSIBLE AUX RAYONS ACTIFS OU AU RAYONNEMENT, FILM DE RÉSERVE, PROCÉDÉ DE FORMATION DE MOTIF, PROCÉDÉ DE FABRICATION D'UN DISPOSITIF ÉLECTRONIQUE ET RÉSINE
(JA) 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法、樹脂
Abstract
(EN)
Provided is an active-ray-sensitive or radiation-sensitive resin composition having excellent exposure latitude. Also provided are: a resist film using the active-ray-sensitive or radiation-sensitive resin composition; a pattern formation method; and a method for manufacturing an electronic device. Also provided is a novel resin. The active-ray-sensitive or radiation-sensitive resin composition includes a resin that includes the repeating unit represented in formula (1), the polarity of the resin increasing due to the effect of an acid.
(FR)
L'invention concerne une composition de résine sensible aux rayons actifs ou au rayonnement ayant une excellente latitude d'exposition. L'invention concerne également un film de réserve utilisant la composition sensible aux rayons actifs ou au rayonnement, un procédé de formation de motif et un procédé de fabrication d'un dispositif électronique. L'invention concerne également une nouvelle résine. La composition de résine sensible aux rayons actifs ou au rayonnement comprend une résine qui comprend le motif récurrent représenté par la formule (1), la polarité de la résine augmentant en raison de l'effet d'un acide.
(JA)
露光ラティチュードに優れた感活性光線性又は感放射線性樹脂組成物を提供する。また、上記感活性光線性又は感放射線性樹脂組成物を用いたレジスト膜、パターン形成方法、及び電子デバイスの製造方法を提供する。また、新規な樹脂を提供する。 感活性光線性又は感放射線性樹脂組成物は、下記式(1)で表される繰り返し単位を含み、酸の作用により極性が増大する樹脂を含む。
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