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1. WO2020008693 - COPPER PASTE AND METHOD FOR FORMING CONDUCTIVE FILM

Publication Number WO/2020/008693
Publication Date 09.01.2020
International Application No. PCT/JP2019/014118
International Filing Date 29.03.2019
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
M
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
1
Inking and printing with a printer's forme
12
Stencil printing; Silk-screen printing
[IPC code unknown for C09D 11/033]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11
Inks
02
Printing inks
10
based on artificial resins
[IPC code unknown for C09D 11/52]
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
H01B 1/22 (2006.01)
B41M 1/12 (2006.01)
C09D 11/033 (2014.01)
C09D 11/10 (2014.01)
C09D 11/52 (2014.01)
H01B 13/00 (2006.01)
CPC
B41M 1/12
C09D 11/033
C09D 11/10
C09D 11/52
H01B 1/22
H01B 13/00
Applicants
  • 石原ケミカル株式会社 ISHIHARA CHEMICAL CO., LTD. [JP/JP]; 兵庫県神戸市兵庫区西柳原町5番26号 5-26, Nishiyanagiwara-cho, Hyogo-ku, Kobe-shi, Hyogo 6520806, JP
Inventors
  • 川戸 祐一 KAWATO, Yuichi; JP
  • 南原 聡 MINAMIHARA, Satoshi; JP
  • 有村 英俊 ARIMURA, Hidetoshi; JP
Agents
  • 弁理士 野口 裕弘 NOGUCHI, Yasuhiro; JP
Priority Data
2018-12725204.07.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COPPER PASTE AND METHOD FOR FORMING CONDUCTIVE FILM
(FR) PÂTE DE CUIVRE ET PROCÉDÉ DE FORMATION DE FILM CONDUCTEUR
(JA) 銅ペースト及び導電膜形成方法
Abstract
(EN)
In the copper paste forming a conductive film upon firing, printing on a substrate by screen offset printing or screen pad printing can be performed and the resin content therein is reduced. The copper paste has copper fine particles, a dispersion medium that contains the copper fine particles, a dispersing agent that makes the copper fine particles to be dispersed in the dispersion medium, and a resin. The copper fine particles include copper fine particles having a median diameter of 10-100 nm. The dispersion medium includes a hydroxy group-bearing organic solvent. The resin dissolves in this organic solvent, and is contained at 1-4 mass% with reference to the overall copper paste. With this, the rheological properties of the copper paste are improved by hydrogen bonding between the copper fine particles and the organic solvent.
(FR)
Dans la pâte de cuivre formant un film conducteur lors de la cuisson, l'impression sur un substrat par impression offset à l'écran ou impression de pavé d'écran peut être effectuée et la teneur en résine dans celle-ci est réduite. La pâte de cuivre a des particules fines de cuivre, un milieu de dispersion qui contient les fines particules de cuivre, un agent de dispersion qui amène les fines particules de cuivre à être dispersées dans le milieu de dispersion, et une résine. Les fines particules de cuivre comprennent des particules fines de cuivre ayant un diamètre médian de 10 à 100 nm. Le milieu de dispersion comprend un solvant organique contenant un groupe hydroxy. La résine se dissout dans ce solvant organique, et est contenue à 1-4 % en masse par rapport à la pâte de cuivre globale. Ainsi, les propriétés rhéologiques de la pâte de cuivre sont améliorées par liaison hydrogène entre les fines particules de cuivre et le solvant organique.
(JA)
焼成して導電膜を形成するための銅ペーストにおいて、スクリーンオフセット印刷又はスクリーンパッド印刷によって基材に印刷可能とするとともに、含まれる樹脂の量を低減する。 銅ペーストは、銅微粒子と、前記銅微粒子を含有する分散媒と、前記銅微粒子を前記分散媒中で分散させる分散剤と、樹脂とを有する。銅微粒子は、メジアン径が10nm以上100nm以下のものを含む。分散媒は、ヒドロキシ基を有する有機溶剤を含む。樹脂は、その有機溶剤に溶ける樹脂であり、銅ペースト全体に対して1重量%以上4重量%以下である。これにより、銅微粒子と有機溶剤との間の水素結合によって銅ペーストのレオロジー特性が改善される。
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