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1. WO2020006920 - OLED PACKAGING STRUCTURE, OLED DISPLAY PANEL AND FABRICATION METHOD THEREFOR

Publication Number WO/2020/006920
Publication Date 09.01.2020
International Application No. PCT/CN2018/109713
International Filing Date 10.10.2018
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 51/50 (2006.01)
H01L 51/52 (2006.01)
H01L 51/56 (2006.01)
CPC
H01L 27/3244
H01L 51/50
H01L 51/5237
H01L 51/56
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN/CN]; 中国湖北省武汉市 东湖新技术开发区高新大道666号光谷生物创新园C5栋305室 305 Room, Building C5, Biolake of Optics Valley, No.666 Gaoxin Avenue, Wuhan East Lake High-Tech Development Zone Wuhan, Hubei 430079, CN
Inventors
  • 杨奇 YANG, Qi; CN
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY; 中国广东省深圳市 福田区深南大道6021号喜年中心A座1709-1711 Room 1709-1711 Block A, Hailrun Complex, No.6021 Shennan Blvd, Futian District Shenzhen, Guangdong 518040, CN
Priority Data
201810729087.405.07.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) OLED PACKAGING STRUCTURE, OLED DISPLAY PANEL AND FABRICATION METHOD THEREFOR
(FR) STRUCTURE D'ENCAPSULATION D'OLED, PANNEAU D'AFFICHAGE À OLED ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(ZH) OLED封装结构、OLED显示面板及其制作方法
Abstract
(EN)
Provided are an OLED packaging structure, an OLED display panel and a fabrication method therefor. The OLED packaging structure (21) comprises a packaging unit (212) and a polarizing layer (211). The packaging unit comprises a first packaging layer (2121), a second packaging layer (2122) and a protective layer (2123). The polarizing layer comprises a first sub-polarizing layer (2111) and a second sub-polarizing layer (2112). The first sub-polarizing layer is disposed between an OLED substrate and the first packaging layer, and the second sub-polarizing layer is disposed between the first packaging layer and the second packaging layer.
(FR)
La présente invention concerne une structure d'encapsulation d'OLED, un panneau d'affichage à OLED ainsi qu'un procédé de fabrication associé. La structure d'encapsulation d'OLED (21) comprend une unité d'encapsulation (212) et une couche de polarisation (211). L'unité d'encapsulation comporte une première couche d'encapsulation (2121), une seconde couche d'encapsulation (2122) et une couche protectrice (2123). La couche de polarisation comprend une première sous-couche de polarisation (2111) et une seconde sous-couche de polarisation (2112). La première sous-couche de polarisation est disposée entre un substrat d'OLED et la première couche d'encapsulation, et la seconde sous-couche de polarisation est disposée entre la première couche d'encapsulation et la seconde couche d'encapsulation.
(ZH)
提供一种OLED封装结构、OLED显示面板及其制作方法。OLED封装结构(21)包括封装单元(212)以及偏光层(211)。封装单元包括第一封装层(2121)、第二封装层(2122)和保护层(2123)。偏光层包括第一子偏光层(2111)和第二子偏光层(2112)。其中,第一子偏光层设置于OLED基板与第一封装层之间,第二子偏光层设置于第一封装层与第二封装层之间。
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