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1. WO2020005749 - TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

Publication Number WO/2020/005749
Publication Date 02.01.2020
International Application No. PCT/US2019/038411
International Filing Date 21.06.2019
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/67 (2006.01)
H01L 21/304 (2006.01)
CPC
B24B 37/015
B24B 37/20
B24B 37/27
B24B 57/02
G05D 23/2401
Applicants
  • APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors
  • SOUNDARARAJAN, Hari; US
  • CHANG, Shou-Sung; US
  • WU, Haosheng; US
  • TANG, Jianshe; US
  • OH, Jeonghoon; US
  • BAJAJ, Rajeev; US
  • SIORDIA, Andrew; US
Agents
  • GOREN, David J.; US
Priority Data
62/690,87627.06.2018US
62/778,20111.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
(FR) RÉGULATION DE TEMPÉRATURE DE POLISSAGE CHIMICO-MÉCANIQUE
Abstract
(EN)
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.
(FR)
Appareil de polissage chimico-mécanique qui comprend un plateau pour maintenir un tampon de polissage, un support pour maintenir un substrat contre une surface de polissage du tampon de polissage pendant un processus de polissage, un distributeur pour fournir un liquide de polissage à la surface de polissage, et un système de régulation de température comprenant un corps conçu pour entrer en contact avec la surface de polissage ou le liquide de polissage sur la surface de polissage. Le corps supporte un module de régulation de température positionné sur le tampon de polissage.
Latest bibliographic data on file with the International Bureau