Processing

Please wait...

Settings

Settings

1. WO2020005254 - ALUMINUM ORGANIC THICKENERS FOR THERMOSET RESINS

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

claimed:

1. A thickener for a molding compound comprising:

an aluminum chelate complex;

10% to 50% by weight of a petroleum distillate; and

10% to 50% by weight of a polyester or polyester acrylate carrier resin.

2. The thickener of claim 1, wherein the petroleum distillate has a boiling point of l75°C or greater.

3. The thickener of claim 1, wherein the aluminum content is 1% to 15% by weight.

4. The thickener of claim 1, wherein the aluminum content is 4% to 10% by weight.

5. The thickener of claim 1, wherein the thickener is essentially free of water.

6. The thickener of claim 4, further comprising a polar solvent in an amount of 0.1 to 30% by weight.

7. The thickener of claim 1, wherein the aluminum chelate complex corresponds to structure III:


III

wherein Ri in structure III is independently selected from C2 to C20 hydrocarbon groups and R2 and R3 are independent selected from Ci to C20 hydrocarbon groups.

8. The thickener of claim 7, wherein R2 and R3 are independently selected from C 1 to Cx hydrocarbon groups.

9. A molding compound comprising:

a thickener including an aluminum chelate complex;

a thermosetting resin;

reinforcing fibers or microspheres;

a crosslinking initiator; and

an inhibitor.

10. The molding compound of claim 9, wherein the thickener further comprises:

10% to 50% by weight of a petroleum distillate.

11. The molding compound of claim 9, wherein the thickener further comprises:

10% to 50% by weight of a polymeric carrier resin.

12. The molding compound of claim 9, wherein the thickener further comprises a polar solvent in an amount of 0.1 to 30% by weight.

13. The molding compound of claim 9, wherein the reinforcing fibers are glass fibers.

14. The molding compound of claim 9, wherein the molding compound is selected from sheet molding compound or bulk molding compound.

15. The molding compound of claim 9, wherein the thermosetting resin is a polyester or vinyl ester resin.

16. The molding compound of claim 9, wherein the molding compound has a flash point of 61 °C or higher.

17. A method of making a molding compound for a molded product, comprising the steps of:

a. forming a resin paste including thermosetting resin, a crosslinking initiator, and an inhibitor;

b. thickening the resin paste by adding an effective amount of thickener to reach a viscosity that is effective to wet-out reinforcing fibers, and is no more than 100,000 cP as determined by a Brookfield viscometer at 1 atm and 25°C to form a thickened resin paste with reinforcing fibers, wherein the thickener includes an aluminum chelate complex

c. dispersing the reinforcing fibers in the resin paste;

d. compounding the thickened resin paste with the reinforcing fibers;

e. after compounding, producing a thickened molding compound by allowing the thickened resin paste with the reinforcing fibers to further thicken to a molding viscosity of 10 to 30 million cP.

18. The method of claim 17, further comprising molding the thickened molding

compound into a final product.

19. The method of claim 17, wherein the viscosity of the thickened molding compound does not drift more than 5% over 24 hours, when tested beginning at 48 hours after addition of the thickener, the viscosity being determined by a Brookfield viscometer at 25°C and 1 Atm.

20. The method of claim 17, wherein the aluminum chelate complex corresponds to

structure III:


III

wherein Ri in structure III is independently selected from C2 to C20 hydrocarbon groups and R2 and R3 are independently selected from Ci to C2o hydrocarbon groups.