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1. WO2020005251 - SWING APPARATUS, METHOD FOR PROCESSING A SUBSTRATE, SWING MODULE FOR RECEIVING A SUBSTRATE FROM A TRANSFER CHAMBER, AND VACUUM PROCESSING SYSTEM

Publication Number WO/2020/005251
Publication Date 02.01.2020
International Application No. PCT/US2018/040004
International Filing Date 28.06.2018
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/67 (2006.01)
CPC
H01L 21/67718
H01L 21/68764
Applicants
  • APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors
  • KIM, Kyung-Tae; KR
  • REDDY, Lokesha; IN
  • SHANMUGAM, Sasikumar; IN
  • HOSOKAWA, Aki; US
Agents
  • PATTERSON, B. Todd; US
  • TACKETT, Keith M.; US
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SWING APPARATUS, METHOD FOR PROCESSING A SUBSTRATE, SWING MODULE FOR RECEIVING A SUBSTRATE FROM A TRANSFER CHAMBER, AND VACUUM PROCESSING SYSTEM
(FR) APPAREIL OSCILLANT, PROCÉDÉ DE TRAITEMENT D'UN SUBSTRAT, MODULE OSCILLANT POUR RECEVOIR UN SUBSTRAT À PARTIR D'UNE CHAMBRE DE TRANSFERT, ET SYSTÈME DE TRAITEMENT SOUS VIDE
Abstract
(EN)
A swing apparatus for moving a substrate relative to one or more deposition sources having a longitudinal axis is described. The swing apparatus includes a support body for holding the substrate; a rotation mechanism coupled to the support body for moving the substrate by an angle around a rotational axis to vary the substrate orientation from a transfer or horizontal orientation to a processing or vertical orientation at a processing area; and a linear motion mechanism coupled to the support body for translating the substrate relative to the longitudinal axis of the deposition source, when the substrate is in the processing orientation.
(FR)
L'invention concerne un appareil oscillant pour déplacer un substrat par rapport à une ou plusieurs sources de dépôt ayant un axe longitudinal. L'appareil oscillant comprend un corps de support pour maintenir le substrat ; un mécanisme de rotation couplé au corps de support pour déplacer le substrat d'un angle autour d'un axe de rotation pour faire varier l'orientation du substrat d'une orientation horizontale de transfert ou horizontale à une orientation de traitement ou verticale au niveau d'une zone de traitement ; et un mécanisme de mouvement linéaire couplé au corps de support pour translater le substrat par rapport à l'axe longitudinal de la source de dépôt, lorsque le substrat est dans l'orientation de traitement.
Latest bibliographic data on file with the International Bureau