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1. WO2020005154 - HEATER FOR SEMICONDUCTOR CHIPS

Publication Number WO/2020/005154
Publication Date 02.01.2020
International Application No. PCT/SG2019/050299
International Filing Date 14.06.2019
IPC
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3
Ohmic-resistance heating
02
Details
06
Heater elements structurally combined with coupling elements or with holders
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
324
Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3
Ohmic-resistance heating
20
Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05B 3/06 (2006.01)
H01L 21/324 (2006.01)
H01L 21/67 (2006.01)
H05B 3/20 (2006.01)
CPC
H01L 21/324
H01L 21/67
H01L 21/6732
H01L 21/67333
H01L 21/67356
H05B 3/06
Applicants
  • INNOVATIVE TOOL TECHNOLOGY PTE LTD [SG/SG]; 133 Woodlands Industrial Park E5, E-Terrace, Singapore 757503, SG
Inventors
  • GOH, Ah Seng; SG
Agents
  • CHANG, Jian Ming; SG
Priority Data
10201805658Q29.06.2018SG
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) HEATER FOR SEMICONDUCTOR CHIPS
(FR) DISPOSITIF DE CHAUFFAGE POUR PUCES SEMI-CONDUCTRICES
Abstract
(EN)
A heater for semiconductor chips, the heater comprising: a casing configured to provide an input slot for a pick and place device to pick or place a plurality of semiconductor chips out of or into the casing respectively; one or more base disposed in the casing for placing the plurality of semiconductor chips thereon for heating; and one or more heating element disposed in the casing for heating the plurality of semiconductor chips.
(FR)
La présente invention concerne un dispositif de chauffage pour puces semi-conductrices, le dispositif de chauffage comprenant : un boîtier configuré pour fournir une fente d'entrée pour un dispositif preneur-placer destiné à saisir ou placer une pluralité de puces semi-conductrices hors ou dans le boîtier respectivement ; une ou plusieurs bases disposées dans le boîtier destinées à placer la pluralité de puces semi-conductrices sur ces dernières pour un chauffage ; et un ou plusieurs éléments chauffants disposés dans le boîtier destinés à chauffer la pluralité de puces semi-conductrices.
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