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1. WO2020004801 - SPUTTERING APPARATUS

Publication Number WO/2020/004801
Publication Date 02.01.2020
International Application No. PCT/KR2019/005038
International Filing Date 26.04.2019
IPC
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
35
by application of a magnetic field, e.g. magnetron sputtering
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
50
Substrate holders
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
54
Controlling or regulating the coating process
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
34
operating with cathodic sputtering
C23C 14/34 (2006.01)
C23C 14/35 (2006.01)
C23C 14/50 (2006.01)
C23C 14/54 (2006.01)
H01J 37/34 (2006.01)
CPC
C23C 14/34
C23C 14/35
C23C 14/50
C23C 14/54
H01J 37/34
Applicants
  • 한국알박(주) ULVAC KOREA CO., LTD. [KR/KR]; 경기도 평택시 청북읍 한산길 39 39, Hansan-gil, Cheongbuk-eup Pyeongtaek-Si Gyeonggi-do 17792, KR
  • 가부시키가이샤 아루박 ULVAC, INC. [JP/JP]; 카나가와현 치가사키시 하기조노 2500 2500 Hagisono Chigasaki, Kanagawa 253-8543, JP
Inventors
  • 정병화 JEONG, Byeong Hwa; KR
  • 장용석 JANG, Yong Seok; KR
  • 박다희 PARK, Da Hee; KR
  • 야기누마칸지 YAGINUMA, Kanji; JP
  • 이와하시테루아키 IWAHASHI, Teruaki; JP
Agents
  • 특허법인 무한 MUHANN PATENT & LAW FIRM; 서울시 강남구 언주로 560, 8층 (역삼동, 화물재단빌딩) (Truck Welfare Foundation Bldg., Yeoksam-dong) 8F, 560, Eonju-ro Gangnam-Gu Seoul 06144, KR
Priority Data
10-2018-007485728.06.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) SPUTTERING APPARATUS
(FR) APPAREIL DE PULVÉRISATION
(KO) 스퍼터링 장치
Abstract
(EN)
A sputtering apparatus according to an embodiment may comprise: a stage rotatable while supporting a substrate having a fine pattern; a target facing the substrate; and a blocking member including a blocking body arranged between the stage and the target, and a through hole which is formed in the blocking body and through which at least a portion of film-forming materials that are separated from the target and proceed to the substrate passes.
(FR)
La présente invention concerne un appareil de pulvérisation selon un mode de réalisation qui peut comprendre : un étage rotatif tout en supportant un substrat ayant un motif fin ; une cible faisant face au substrat ; et un élément de blocage comprenant un corps de blocage disposé entre l'étage et la cible et un trou traversant qui est formé dans le corps de blocage et à travers lequel passe au moins une partie des matériaux de formation de film qui sont séparés de la cible et qui s'étendent jusqu'au substrat.
(KO)
일 실시 예에 따른 스퍼터링 장치는, 미세 패턴을 구비하는 기판을 지지한 상태로 회전 가능한 스테이지; 상기 기판과 마주하는 타겟; 및 상기 스테이지 및 타겟 사이에 배치되는 차단 바디와, 상기 차단 바디에 형성되고 상기 타겟으로부터 분리되어 상기 기판으로 진행하는 성막 물질의 적어도 일부를 통과시키는 통과 홀을 포함하는 차단 부재를 포함할 수 있다.
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