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1. WO2020004442 - THERMALLY CONDUCTIVE SILICONE COMPOSITION AND THERMALLY CONDUCTIVE SHEET

Publication Number WO/2020/004442
Publication Date 02.01.2020
International Application No. PCT/JP2019/025311
International Filing Date 26.06.2019
IPC
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
[IPC code unknown for C08K 3/013]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5
Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08
Materials not undergoing a change of physical state when used
14
Solid materials, e.g. powdery or granular
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
C08L 83/04 (2006.01)
C08K 3/013 (2018.01)
C09K 5/14 (2006.01)
H01L 23/36 (2006.01)
H01L 23/373 (2006.01)
CPC
C08K 3/013
C08L 83/04
C09K 5/14
H01L 23/36
H01L 23/373
Applicants
  • 信越化学工業株式会社 SHIN-ETSU CHEMICAL CO., LTD. [JP/JP]; 東京都千代田区大手町二丁目6番1号 6-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors
  • 山田 邦弘 YAMADA Kunihiro; JP
Agents
  • 特許業務法人英明国際特許事務所 PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE; 東京都中央区銀座二丁目16番12号 銀座大塚ビル2階 GINZA OHTSUKA Bldg. 2F, 16-12, Ginza 2-chome, Chuo-ku, Tokyo 1040061, JP
Priority Data
2018-12298228.06.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) THERMALLY CONDUCTIVE SILICONE COMPOSITION AND THERMALLY CONDUCTIVE SHEET
(FR) COMPOSITION DE SILICONE THERMOCONDUCTRICE ET FEUILLE THERMOCONDUCTRICE
(JA) 熱伝導性シリコーン組成物及び熱伝導性シート
Abstract
(EN)
Provided is a thermally conductive silicone composition containing (A) a liquid silicone and (B) a thermally conductive filler, wherein component (A) is a silicone mixture of two or more kinds of substances, and at least two of the substances are incompatible with each other.
(FR)
L'invention concerne une composition de silicone thermoconductrice contenant (A) une silicone liquide et (B) une charge thermoconductrice, le composant (A) étant un mélange de silicone d'au moins deux types de substances, et au moins deux des substances étant incompatibles l'une avec l'autre.
(JA)
(A)液状シリコーンと、(B)熱伝導性充填剤とを含む熱伝導性シリコーン組成物であって、(A)成分が少なくとも2種類以上のシリコーン混合物であり、そのうち少なくとも2種類は互いに非相溶性を示すことを特徴とする熱伝導性シリコーン組成物。
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