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1. WO2020004338 - RESIN-ATTACHED METAL FOIL

Publication Number WO/2020/004338
Publication Date 02.01.2020
International Application No. PCT/JP2019/024975
International Filing Date 24.06.2019
IPC
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
082
comprising vinyl resins; comprising acrylic resins
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
3
Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form
26
characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids
30
characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
27
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
02
not modified by chemical after-treatment
12
containing fluorine atoms
18
Homopolymers or copolymers of tetrafluoroethene
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
B32B 15/082 (2006.01)
B32B 3/30 (2006.01)
C08L 27/18 (2006.01)
H05K 1/03 (2006.01)
CPC
B32B 15/082
B32B 3/30
C08L 27/18
H05K 1/03
Applicants
  • AGC株式会社 AGC INC. [JP/JP]; 東京都千代田区丸の内一丁目5番1号 5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008405, JP
Inventors
  • 山邊 敦美 YAMABE Atsumi; JP
  • 細田 朋也 HOSODA Tomoya; JP
  • 笠井 渉 KASAI Wataru; JP
  • 寺田 達也 TERADA Tatsuya; JP
Agents
  • 特許業務法人T.S.パートナーズ T.S. PARTNERS; 東京都千代田区神田司町二丁目8番地1 PMO神田司町3階 3rd Floor, PMO Kanda-Tsukasamachi, 2-8-1, Kanda-Tsukasamachi, Chiyoda-ku, Tokyo 1010048, JP
  • 泉名 謙治 SENMYO Kenji; JP
  • 小川 利春 OGAWA Toshiharu; JP
  • 金 鎭文 KIM Jin-Moon; JP
  • 比企野 健 HIKINO Ken; JP
  • 横井 大一郎 YOKOI Daiichiro; JP
Priority Data
2018-12210627.06.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN-ATTACHED METAL FOIL
(FR) FEUILLE MÉTALLIQUE FIXÉE À UNE RÉSINE
(JA) 樹脂付金属箔
Abstract
(EN)
The purpose of the present invention is to provide: a resin-attached metal foil which has a non-porous resin layer including a fluoropolymer and which has high peeling strength, is hard to warp, and has excellent electric characteristics; and a method for manufacturing a print wiring board using the resin-attached metal foil. This resin-attached metal foil has: a metal foil with an uneven surface; and a non-porous resin layer which includes a tetra fluoro ethylene-based polymer and which abuts the uneven surface of the metal foil, wherein a void is present in a portion of the interface between the metal foil and the non-porous resin layer.
(FR)
La présente invention a pour objet : une feuille métallique fixée à une résine qui a une couche de résine non poreuse incluant un fluoropolymère, qui présente une grande résistance au pelage, est difficile à voiler et présente d’excellentes caractéristiques électriques ; et un procédé de fabrication d’une carte de circuit imprimé à l’aide de la feuille métallique fixée à une résine. Cette feuille métallique fixée à une résine comprend : une feuille métallique ayant une surface non plane ; et une couche de résine non poreuse qui inclut un polymère à base de tétrafluoroéthylène et qui vient en butée contre la surface non plane de la feuille métallique, un vide étant présent dans une partie de l’interface entre la feuille métallique et la couche de résine non poreuse.
(JA)
本発明は、剥離強度が高く、反りにくい、電気特性に優れた、フルオロポリマーを含む非多孔性樹脂層を有する樹脂付金属箔、及び前記樹脂付金属箔を用いたプリント配線板の製造方法を提供することを目的とする。 凹凸面を有する金属箔と、前記金属箔の凹凸面に当接したテトラフルオロエチレン系ポリマーを含む非多孔性樹脂層とを有し、前記金属箔と前記非多孔性樹脂層の界面の一部に空隙が存在する、樹脂付金属箔。
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