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1. WO2020004214 - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Publication Number WO/2020/004214
Publication Date 02.01.2020
International Application No. PCT/JP2019/024478
International Filing Date 20.06.2019
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26
DRYING
B
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
5
Drying solid materials or objects by processes not involving the application of heat
04
by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
06
the process involving freezing
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26
DRYING
B
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
5
Drying solid materials or objects by processes not involving the application of heat
16
by contact with sorbent bodies, e.g. absorbent mould; by admixture with sorbent materials
H01L 21/304 (2006.01)
F26B 5/06 (2006.01)
F26B 5/16 (2006.01)
CPC
F26B 5/06
F26B 5/16
H01L 21/304
Applicants
  • 株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP/JP]; 京都府京都市上京区堀川通寺之内上る四丁目天神北町1番地の1 1-1, Tenjinkita-machi, Teranouchi-agaru 4-chome, Horikawa-dori, Kamigyo-ku, Kyoto-shi, Kyoto 6028585, JP
Inventors
  • 藤原 直澄 FUJIWARA, Naozumi; JP
  • 山口 佑 YAMAGUCHI, Yu; JP
  • 尾辻 正幸 OTSUJI, Masayuki; JP
  • 加藤 雅彦 KATO, Masahiko; JP
  • 佐々木 悠太 SASAKI, Yuta; JP
  • ▲高▼橋 弘明 TAKAHASHI, Hiroaki; JP
Agents
  • 特許業務法人あい特許事務所 AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS; 大阪府大阪市中央区南本町二丁目6番12号 サンマリオンNBFタワー21階 Sun Mullion NBF Tower, 21st Floor, 6-12, Minamihommachi 2-chome, Chuo-ku, Osaka-shi, Osaka 5410054, JP
Priority Data
2018-12474529.06.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
(FR) APPAREIL DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置および基板処理方法
Abstract
(EN)
This substrate processing method comprises: a mixed drying assistant material supply step wherein a mixed drying assistant material, which is obtained by mixing together a drying assistant material, a first solvent, and an agent that is different from the drying assistant material and the first solvent, is supplied to the surface of a substrate; a solidified film formation step wherein a solidified film that contains the drying assistant material and the agent is formed by evaporating the first solvent from the mixed drying assistant material that is present on the surface of the substrate and by solidifying the drying assistant material contained in the mixed drying assistant material; and a removal step wherein the drying assistant material contained in the solidified film is removed.
(FR)
Selon la présente invention, ce procédé de traitement de substrat comprend : une étape d'alimentation en matériau mélangé contribuant au séchage dans laquelle un matériau mélangé contribuant au séchage, qui est obtenu par mélange ensemble d'un matériau contribuant au séchage, d'un premier solvant, et d'un agent qui est différent du matériau contribuant au séchage et du premier solvant, est fourni à la surface d'un substrat ; une étape de formation de film solidifié dans laquelle un film solidifié qui contient le matériau contribuant au séchage et l'agent est formé par évaporation du premier solvant à partir du matériau contribuant au séchage mélangé qui est présent sur la surface du substrat et par solidification du matériau contribuant au séchage contenu dans le matériau mélangé contribuant au séchage mélangé ; et une étape de retrait dans laquelle le matériau contribuant au séchage contenu dans le film solidifié est retiré.
(JA)
この基板処理方法は、乾燥補助物質と、第1の溶媒と、前記乾燥補助物質および前記第1の溶媒とは異なる薬剤とが互いに混ざり合った混合乾燥補助物質を、基板の表面に供給する混合乾燥補助物質供給工程と、前記基板の表面に存在する前記混合乾燥補助物質から前記第1の溶媒を蒸発させかつ前記混合乾燥補助物質に含まれる前記乾燥補助物質を固化させることにより、前記乾燥補助物質および前記薬剤を含む固化膜を形成する固化膜形成工程と、前記固化膜に含まれる前記乾燥補助物質を除去する除去工程とを含む。
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