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1. WO2020004176 - SUBSTRATE STRUCTURE

Publication Number WO/2020/004176
Publication Date 02.01.2020
International Application No. PCT/JP2019/024301
International Filing Date 19.06.2019
IPC
G PHYSICS
01
MEASURING; TESTING
K
MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
1
Details of thermometers not specially adapted for particular types of thermometer
16
Special arrangements for conducting heat from the object to the sensitive element
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
G01K 1/16 (2006.01)
H05K 1/14 (2006.01)
CPC
G01K 1/16
H05K 1/14
Applicants
  • 株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehirocho, Yokkaichi-shi, Mie 5108503, JP
  • 住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehirocho, Yokkaichi-shi, Mie 5108503, JP
  • 住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors
  • 平谷 俊悟 HIRATANI, Shungo; JP
  • 田原 秀哲 TAHARA, Hideaki; JP
  • 中村 有延 NAKAMURA, Arinobu; JP
  • 鄭 尚熙 CHON, Sanhi; JP
Agents
  • 河野 英仁 KOHNO, Hideto; JP
  • 河野 登夫 KOHNO, Takao; JP
Priority Data
2018-12115526.06.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE STRUCTURE
(FR) STRUCTURE DE SUBSTRAT
(JA) 基板構造体
Abstract
(EN)
Provided is a substrate structure which includes an electronic component that emits heat and a thermistor (40) that is mounted on a circuit board (12) provided apart from the electronic component and is for detecting the temperature of the electronic component, the substrate structure comprising: a heat conducting pattern (124) that is formed so as to surround the thermistor (40); and a heat conducting member (115) that conducts heat from the electronic component to the heat conducting pattern (124).
(FR)
L'invention concerne une structure de substrat qui comprend un composant électronique qui émet de la chaleur et une thermistance (40) qui est montée sur une carte de circuit imprimé (12) disposée à distance du composant électronique et qui sert à détecter la température du composant électronique, la structure de substrat comprenant : un motif conducteur de chaleur (124) qui est formé de manière à entourer la thermistance (40) ; et un élément conducteur de chaleur (115) qui conduit la chaleur du composant électronique au motif conducteur de chaleur (124).
(JA)
熱を発する電子部品と、該電子部品から離隔配置された回路基板(12)に実装され、前記電子部品の温度を検出するサーミスタ(40)とを備える基板構造体において、サーミスタ(40)を取り囲んで形成された熱伝パターン(124)と、前記電子部品からの熱を前記熱伝パターン(124)に伝える熱伝部材(115)とを備える。
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