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1. WO2020004157 - ELECTRONIC EQUIPMENT

Publication Number WO/2020/004157
Publication Date 02.01.2020
International Application No. PCT/JP2019/024173
International Filing Date 18.06.2019
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
06
characterised by the material of the container or its electrical properties
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
H01L 23/00 (2006.01)
H01L 23/06 (2006.01)
H01L 23/28 (2006.01)
H01L 23/36 (2006.01)
H05K 7/20 (2006.01)
H05K 9/00 (2006.01)
CPC
H01L 23/00
H01L 23/06
H01L 23/28
H01L 23/36
H05K 7/20
H05K 9/00
Applicants
  • デクセリアルズ株式会社 DEXERIALS CORPORATION [JP/JP]; 東京都品川区大崎1丁目11番2号 ゲートシティ大崎イーストタワー8階 Gate City Osaki, East Tower 8F, 1-11-2, Osaki, Shinagawa-ku, Tokyo 1410032, JP
Inventors
  • 久保 佑介 KUBO, Yusuke; JP
  • ボロトフ セルゲイ BOLOTOV, Sergey; JP
Agents
  • 野口 信博 NOGUCHI, Nobuhiro; JP
Priority Data
2018-12135426.06.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC EQUIPMENT
(FR) ÉQUIPEMENT ÉLECTRONIQUE
(JA) 電子機器
Abstract
(EN)
Provided is electronic equipment which can simultaneously achieve heat dissipation properties, electromagnetic wave suppression effects, and ESD countermeasures at high levels. The electronic equipment includes: an electronic component 30 which is provided on a substrate 31; a conductive shield can 20 which has an opening 21, is provided to surround the electronic component 30, and is connected to the ground 32; a conductive cooling member 40 which is provided above the conductive shield can 20; a conductive thermal conduction sheet 10 which is provided between the electronic component 30 and the conductive cooling member 40; and an insulating member 50 which is provided between the conductive thermal conduction sheet 10 and the conductive cooling member 40, and faces the electronic component 30 through the opening 21. The insulating member 50 is larger than an area of the electronic component 30 which the insulating member 50 faces through the opening 21 and is electrically connected to the conductive shield can 20 and the conductive cooling member 40 through the conductive thermal conduction sheet 10.
(FR)
L'invention concerne un équipement électronique qui peut simultanément obtenir des propriétés de dissipation thermique, des effets de suppression d'ondes électromagnétiques et des contre-mesures aux décharges électrostatiques à des niveaux élevés. L'équipement électronique comprend : un composant électronique 30 qui est disposé sur un substrat 31 ; une gaine de blindage conductrice 20 qui a une ouverture 21, est prévue pour entourer le composant électronique 30, et est connectée à la masse 32 ; un élément de refroidissement conducteur 40 qui est disposé au-dessus de la gaine conductrice 20 ; une feuille de conduction thermique conductrice 10 qui est disposée entre le composant électronique 30 et l'élément de refroidissement conducteur 40 ; et un élément isolant 50 qui est disposé entre la feuille de conduction thermique conductrice 10 et l'élément de refroidissement conducteur 40, et fait face au composant électronique 30 à travers l'ouverture 21. L'élément isolant 50 est plus grand qu'une zone du composant électronique 30 que l'élément isolant 50 fait face à travers l'ouverture 21 et est électriquement connecté à la gaine conductrice 20 et à l'élément de refroidissement conducteur 40 à travers la feuille de conduction thermique conductrice 10.
(JA)
放熱性、電磁波抑制効果及びESD対策を同時に高いレベルで実現できる電子機器を提供する。 基板31上に設けられた電子部品30と、開口部21を有し、電子部品30を囲うように設けられ、グラウンド32に接続された導電シールドカン20と、導電シールドカン20の上部に設けられた導電性冷却部材40と、電子部品30と導電性冷却部材40との間に設けられた導電性熱伝導シート10と、導電性熱伝導シート10と導電性冷却部材40との間に設けられ、開口部21を介して電子部品30と対向する絶縁部材50とを備え、絶縁部材50は、開口部21を介して対向する電子部品30の領域以上の大きさを有し、導電性熱伝導シート10を介して導電シールドカン20と導電性冷却部材40とが電気的に接続されている。
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