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1. WO2020003995 - MACHINING DEVICE, MACHINING METHOD, AND COMPUTER STORAGE MEDIUM

Publication Number WO/2020/003995
Publication Date 02.01.2020
International Application No. PCT/JP2019/022959
International Filing Date 10.06.2019
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
41
Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks
06
Work supports, e.g. adjustable steadies
H01L 21/304 (2006.01)
B24B 41/06 (2012.01)
CPC
B24B 41/06
H01L 21/304
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 東京都港区赤坂五丁目3番1号 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325, JP
Inventors
  • 金子 知広 KANEKO, Tomohiro; JP
  • 原 圭孝 HARA, Yoshitaka; JP
Agents
  • 金本 哲男 KANEMOTO, Tetsuo; JP
  • 萩原 康司 HAGIWARA, Yasushi; JP
  • 扇田 尚紀 OGITA, Naoki; JP
  • 三根 卓也 MINE, Takuya; JP
Priority Data
2018-12061726.06.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) MACHINING DEVICE, MACHINING METHOD, AND COMPUTER STORAGE MEDIUM
(FR) DISPOSITIF ET PROCÉDÉ D'USINAGE AINSI QUE SUPPORT D'ENREGISTREMENT INFORMATIQUE
(JA) 加工装置、加工方法及びコンピュータ記憶媒体
Abstract
(EN)
This machining device for machining a substrate includes: a plurality of rotary holding units for holding and rotating a substrate; a plurality of conveyance units for conveying the substrate; a plurality of processing units for consecutively processing the substrate; and a control unit for respectively grouping and controlling the plurality of rotary holding units, the plurality of conveyance units, and the plurality of processing units. The control unit: respectively manages states of the rotary holding units, states of the conveyance units, and states of the processing units; controls holding of the substrate at the plurality of rotary holding units in accordance with the states of the rotary holding units; controls conveyance of the substrate at the plurality of conveyance units in accordance with the states of the conveyance units; and controls processing of the substrate at the plurality of processing units in accordance with the states of the processing units.
(FR)
La présente invention concerne un dispositif d'usinage permettant d'usiner un substrat, comprenant : une pluralité d'unités de maintien rotatives destinées à maintenir et à faire tourner un substrat ; une pluralité d'unités de transport destinées à transporter le substrat ; une pluralité d'unités de traitement permettant de traiter consécutivement le substrat ; et une unité de commande servant à regrouper et à commander respectivement les unités de la pluralité d'unités de maintien rotatives, de la pluralité d'unités de transport et de la pluralité d'unités de traitement. L'unité de commande : gère respectivement des états des unités de maintien rotatives, des états des unités de transport et des états des unités de traitement ; commande le maintien du substrat au niveau des unités de la pluralité d'unités de maintien rotatives conformément aux états des unités de maintien rotatives ; commande le transport du substrat au niveau des unités de la pluralité d'unités de transport conformément aux états des unités de transport ; et commande le traitement du substrat au niveau des unités de la pluralité d'unités de traitement conformément aux états des unités de traitement.
(JA)
基板を加工する加工装置であって、基板を保持して回転させる複数の回転保持部と、基板を搬送する複数の搬送部と、基板に連続して処理を行う複数の処理部と、前記複数の回転保持部、前記複数の搬送部、及び前記複数の処理部をそれぞれグループ化して制御する制御部と、を有し、前記制御部は、前記回転保持部の状態、前記搬送部の状態、及び前記処理部の状態をそれぞれ管理し、前記回転保持部の状態に応じて、前記複数の回転保持部における基板の保持を制御し、前記搬送部の状態に応じて、前記複数の搬送部における基板の搬送を制御し、前記処理部の状態に応じて、前記複数の処理部における基板の処理を制御する。
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