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1. WO2020003207 - METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE

Publication Number WO/2020/003207
Publication Date 02.01.2020
International Application No. PCT/IB2019/055466
International Filing Date 27.06.2019
IPC
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
04
the conductive material being removed mechanically, e.g. by punching
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
3
Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form
26
characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids
30
characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H05K 3/04 (2006.01)
H05K 1/02 (2006.01)
B32B 3/30 (2006.01)
G06F 3/041 (2006.01)
CPC
B32B 3/30
G06F 3/041
H05K 1/02
H05K 3/04
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US/US]; 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427, US
Inventors
  • VAN LENGERICH, Henrik B.; US
  • STAY, Matthew S.; US
  • NELSON, Caleb T.; US
  • TARNOWSKI, David J.; US
  • ROWE, David J.; US
  • KUSILEK, Edwin L.; US
Agents
  • DONG, Yufeng; US
  • BLANK, Colene H.,; US
  • FLORCZAK, Yen Tong,; US
  • HARTS, Dean M. ,; US
  • LEVINSON, Eric D.,; US
  • MAKI, Eloise J.,; US
  • NOWAK, Sandra K.,; US
  • RINGSRED, Ted K.,; US
Priority Data
62/691,45928.06.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE
(FR) PROCÉDÉS DE FABRICATION DE MOTIFS MÉTALLIQUES SUR UN SUBSTRAT SOUPLE
Abstract
(EN)
Methods of making metal patterns on flexible substrates are provided. Releasable solid layer is selectively formed on a patterned surface of the flexible substrate by applying a liquid solution thereon. Metal patterns on the flexible substrate can be formed by removing the releasable solid layer after metallization. In some cases, the releasable solid layer can be transferred from the patterned surface to a transfer layer where the metal patterns are formed.
(FR)
L'invention concerne des procédés de fabrication de motifs métalliques sur des substrats souples. Une couche solide libérable est formée sélectivement sur une surface à motifs du substrat souple par application d'une solution liquide sur celle-ci. Des motifs métalliques sur le substrat souple peuvent être formés par retrait de la couche solide libérable après métallisation. Dans certains cas, la couche solide libérable peut être transférée de la surface à motifs à une couche de transfert où les motifs métalliques sont formés.
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