PATENTSCOPE will be unavailable a few hours for maintenance reason on Monday 03.02.2020 at 10:00 AM CET
Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2020000228) THERMAL GAP FILLER AND ITS APPLICATION FOR BATTERY MANAGEMENT SYSTEM
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2020/000228 International Application No.: PCT/CN2018/092983
Publication Date: 02.01.2020 International Filing Date: 27.06.2018
IPC:
C08L 83/07 (2006.01) ,C08K 3/08 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
02
Elements
08
Metals
Applicants:
DOW SILICONES CORPORATION [US/US]; 2200 West Salzburg Road Midland, Michigan 48686-0994, US
ZHENG, Yan [CN/CN]; CN (SC)
CAO, Zhongwei [CN/CN]; CN (SC)
HUANG, Qiang [CN/CN]; CN (SC)
YANG, Rui [CN/CN]; CN (SC)
TEIXEIRA, Sandrine [BE/BE]; BE (SC)
XIE, Lujing [CN/CN]; CN (SC)
Inventors:
ZHENG, Yan; CN
CAO, Zhongwei; CN
HUANG, Qiang; CN
YANG, Rui; CN
TEIXEIRA, Sandrine; BE
XIE, Lujing; CN
Agent:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC; 435 Guiping Road Shanghai 200233, CN
Priority Data:
Title (EN) THERMAL GAP FILLER AND ITS APPLICATION FOR BATTERY MANAGEMENT SYSTEM
(FR) CHARGE D'ESPACE THERMIQUE ET SON APPLICATION À UN SYSTÈME DE GESTION DE BATTERIE
Abstract:
(EN) A thermally conductive silicone composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpoly siloxane having an average of two to four silicon-bonded hydrogen mponent (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.
(FR) L'invention concerne une composition de silicone thermoconductrice qui comprend : (A) un organopolysiloxane contenant un groupe alcényle ; (B) un organohydrogénopolysiloxane présentant une moyenne de deux à quatre atomes d'hydrogène liés au silicium dans le constituant (B) qui représente de 0,2 à 5 moles par mole des groupes alcényle présents dans le constituant (A), et au moins deux des atomes d'hydrogène liés au silicium étant situés sur les chaînes latérales de la molécule ; (C) un catalyseur de réaction d'hydrosilylation ; (D) une charge thermoconductrice ; (E) un alcoxysilane possédant un groupe alkyle contenant au moins 6 atomes de carbone dans une molécule ; et (F) des billes de verre. Un élément thermoconducteur est produit à partir de la composition de silicone thermoconductrice. Un dispositif électronique comprend l'élément thermoconducteur et un procédé de fabrication du dispositif électronique consiste à utiliser la composition de silicone thermoconductrice.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)