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1. WO2019226637 - LASER WELDING COATED SUBSTRATES

Publication Number WO/2019/226637
Publication Date 28.11.2019
International Application No. PCT/US2019/033291
International Filing Date 21.05.2019
IPC
B23K 26/08 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
B23K 26/24 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
20Bonding
21by welding
24Seam welding
B23K 26/324 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
20Bonding
32taking account of the properties of the material involved
324involving non-metallic parts
B23K 26/12 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
12in a special environment or atmosphere, e.g. in an enclosure
B23K 26/0622 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0622by shaping pulses
B23K 26/57 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
57the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
CPC
B23K 2103/166
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
16Composite materials ; , e.g. fibre reinforced
166Multilayered materials
B23K 2103/50
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
B23K 2103/52
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
52Ceramics
B23K 2103/54
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
54Glass
B23K 26/0622
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0622by shaping pulses
B23K 26/083
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
083Devices involving movement of the workpiece in at least one axial direction
Applicants
  • CORNING INCORPORATED [US]/[US]
Inventors
  • LOGUNOV, Stephan Lvovich
  • QUESADA, Mark Alejandro
  • STRELTSOV, Alexander Mikhailovich
Agents
  • HOOD, Michael A.
Priority Data
62/675,08922.05.2018US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) LASER WELDING COATED SUBSTRATES
(FR) SUBSTRATS REVÊTUS PAR SOUDAGE AU LASER
Abstract
(EN) Disclosed herein are methods of bonding a multi-layer film to a substrate and resulting structures thereof. A method of laser bonding a multi-layer film to a substrate can include forming a film over a first surface of a first substrate that is transmissive to light at a first wavelength. The film may include a reflective layer that is reflective to light at the first wavelength and a refractive layer that is refractive to light at the first wavelength. The method may include irradiating a region of the film using laser radiation passing through the first substrate. A wavelength profile of the laser radiation can have a peak at about the first wavelength. The first wavelength can be between about 300 nm and about 5000 nm.
(FR) La présente invention concerne des procédés de liaison d'un film multicouche à un substrat et des structures résultantes de ceux-ci. Un procédé de liaison laser d'un film multicouche à un substrat peut comprendre les étapes consistant à former un film sur une première surface d'un premier substrat qui transmet la lumière à une première longueur d'onde. Le film peut comprendre une couche réfléchissante qui réfléchit la lumière à la première longueur d'onde et une couche réfractive qui réfracte la lumière à la première longueur d'onde. Le procédé peut comprendre l'irradiation d'une région du film à l'aide d'un rayonnement laser traversant le premier substrat. Un profil de longueur d'onde du rayonnement laser peut avoir un pic à environ la première longueur d'onde. La première longueur d'onde peut être comprise entre environ 300 nm et environ 5 000 nm.
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