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1. WO2019221809 - METHOD AND APPARATUS FOR COOLING OF AN ELECTRONIC DEVICE

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Publication Number WO/2019/221809
Publication Date 21.11.2019
International Application No. PCT/US2019/022426
International Filing Date 15.03.2019
IPC
H01L 23/427 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H01L 23/4275
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
4275by melting or evaporation of solids
H01L 45/1286
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
45Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
04Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
12Details
128Thermal details
1286Heating or cooling means other than resistive heating electrodes, e.g. heater in parallel
H01L 45/1293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
45Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
04Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
12Details
128Thermal details
1293Thermal insulation means
H05K 7/20454
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
20445the coupling element being an additional piece, e.g. thermal standoff
20454with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
Applicants
  • QUALCOMM INCORPORATED [US]/[US]
Inventors
  • ROSALES, Jorge Luis
  • CHIRIAC, Victor
  • ANDREWS, Sean Charles
Agents
  • GALLARDO, Michelle
Priority Data
15/981,93117.05.2018US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND APPARATUS FOR COOLING OF AN ELECTRONIC DEVICE
(FR) PROCÉDÉ ET APPAREIL DE REFROIDISSEMENT D'UN DISPOSITIF ÉLECTRONIQUE
front page image
Abstract
(EN) Some features pertain to an apparatus that includes a first heat spreader and a second heat spreader, a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersects the second plurality of portions, and a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.
(FR) Selon la présente invention, certaines caractéristiques concernent un appareil qui comprend un premier dissipateur thermique et un second dissipateur thermique, un dissipateur thermique matriciel, le dissipateur thermique matriciel comprenant une première pluralité de parties perpendiculaires à une seconde pluralité de parties, la première pluralité de parties croisant la seconde pluralité de parties, et un système à changement de phase (PCM) situé dans une pluralité de réservoirs délimités par le dissipateur thermique matriciel.
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