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1. WO2019220287 - CONTROL CURE THERMALLY-CONDUCTIVE GAP FILLER MATERIALS

Publication Number WO/2019/220287
Publication Date 21.11.2019
International Application No. PCT/IB2019/053877
International Filing Date 10.05.2019
IPC
C08K 9/02 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9Use of pretreated ingredients
02Ingredients treated with inorganic substances
C08K 5/42 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
36Sulfur-, selenium-, or tellurium-containing compounds
41Compounds containing sulfur bound to oxygen
42Sulfonic acids; Derivatives thereof
C08L 101/00 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
CPC
C08K 13/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
13Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
06Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
C08K 2003/0812
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
0812Aluminium
C08K 2003/2296
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
2296of zinc
C08K 2201/001
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
2201Specific properties of additives
001Conductive additives
C08K 2201/014
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
2201Specific properties of additives
014Additives containing two or more different additives of the same subgroup in C08K
C08K 3/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US]
Inventors
  • WERNESS, Jenny B.
  • JURJEVIC, Simone
  • GOEB, Siegfried R.
  • BISSINGER, Peter
  • STEIGER, Wolf
  • HIGGINS, Jeremy M.
  • EICHLER, Jens
Agents
  • BRAMWELL, Adam M.
  • RHODES, Kevin H.
  • BLANK, Colene H.,
  • HARTS, Dean M. ,
  • LEVINSON, Eric D.,
  • MAKI, Eloise J.,
  • NOWAK, Sandra K.,
  • RINGSRED, Ted K.,
Priority Data
62/670,91714.05.2018US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) CONTROL CURE THERMALLY-CONDUCTIVE GAP FILLER MATERIALS
(FR) MATÉRIAUX DE REMPLISSAGE D'ESPACE THERMIQUEMENT CONDUCTEURS À DURCISSEMENT SUR COMMANDE
Abstract
(EN) Control cure thermally-conductive gap filler materials are described, as are methods of curing. Also described are curing agents and methods of making curing agents.
(FR) L'invention concerne des matériaux de remplissage d'espace thermoconducteur durcissant sur commande, ainsi que des procédés de durcissement. L'invention concerne également des agents de durcissement et des procédés de fabrication d'agents de durcissement.
Latest bibliographic data on file with the International Bureau