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1. WO2019216388 - CURABLE COMPOSITION, MATERIAL FOR PROTECTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Publication Number WO/2019/216388
Publication Date 14.11.2019
International Application No. PCT/JP2019/018624
International Filing Date 09.05.2019
IPC
C08L 63/00 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08G 59/04 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
02Polycondensates containing more than one epoxy group per molecule
04of polyhydroxy compounds with epihalohydrins or precursors thereof
C08K 3/013 2018.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
013Fillers, pigments or reinforcing additives
C08K 3/22 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08K 3/34 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
H01L 23/29 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
CPC
C08G 59/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
02Polycondensates containing more than one epoxy group per molecule
04of polyhydroxy compounds with epihalohydrins or precursors thereof
C08K 3/013
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
01characterized by their specific function
013Fillers, pigments or reinforcing additives
C08K 3/22
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08K 3/34
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
C08L 63/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
Applicants
  • 積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 西村 貴史 NISHIMURA, Takashi
  • 中村 秀 NAKAMURA, Shigeru
  • 小林 祐輔 KOBAYASHI, Yuusuke
Agents
  • 田口 昌浩 TAGUCHI, Masahiro
  • 虎山 滋郎 TORAYAMA, Jiro
Priority Data
2018-09161010.05.2018JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE COMPOSITION, MATERIAL FOR PROTECTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DURCISSABLE, MATÉRIAU PERMETTANT LA PROTECTION D'UN ÉLÉMENT À SEMICONDUCTEURS, ET DISPOSITIF À SEMICONDUCTEURS
(JA) 硬化性組成物、半導体素子保護用材料、及び半導体装置
Abstract
(EN) The present invention is a curable composition including an epoxy compound (A), a curing agent (B) which is liquid at 23°C, an inorganic filler (C) which has a thermal conductivity of 10 W/m∙K or greater and is spherical, and an ion exchanger (X), the ion exchanger (X) comprising a zirconium-based cation exchanger and a bismuth-based anion exchanger. Through the present invention, it is possible to provide a curable composition having excellent heat dissipation properties, insulating reliability, and application properties.
(FR) La présente invention concerne une composition durcissable comprenant un composé époxy (A), un agent de durcissement (B) qui est liquide à 23 °C, une charge inorganique (C) qui présente une conductivité thermique de 10 W/m∙K ou plus et qui est sphérique, et un échangeur d'ions (X), l'échangeur d'ions (X) comprenant un échangeur de cations à base de zirconium et un échangeur d'anions à base de bismuth. Grâce à la présente invention, il est possible de fournir une composition durcissable présentant d'excellentes propriétés de dissipation de la chaleur, une excellente fiabilité en isolation, et d'excellentes propriétés en cours d'application.
(JA) 本発明は、エポキシ化合物(A)と、23℃で液状である硬化剤(B)と、熱伝導率10W/m・K以上であり、かつ球状である無機フィラー(C)と、イオン交換体(X)とを含み、前記イオン交換体(X)が、ジルコニウム系陽イオン交換体及びビスマス系陰イオン交換体とからなる、硬化性組成物である。本発明によれば、放熱性、絶縁信頼性及び塗布性に優れる硬化性組成物を提供することができる。
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