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1. WO2019215829 - METHOD AND APPARATUS FOR MANUFACTURING FLEXIBLE LIGHT-EMITTING DEVICE

Publication Number WO/2019/215829
Publication Date 14.11.2019
International Application No. PCT/JP2018/017898
International Filing Date 09.05.2018
IPC
H05B 33/10 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
B32B 17/10 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
17Layered products essentially comprising sheet glass, or fibres of glass, slag or the like
06comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
10of synthetic resin
G09F 9/30 2006.1
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
G09F 9/33 2006.1
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 33/00 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 51/50 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
CPC
B32B 17/10
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
17Layered products essentially comprising sheet glass, or glass, slag, or like fibres
06comprising glass as the main or only constituent of a layer, next to another layer of a specific ; material
10of synthetic resin
G09F 9/30
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
G09F 9/33
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 2251/5338
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2251Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
50Organic light emitting devices
53Structure
5338Flexible OLED
H01L 2251/566
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2251Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
50Organic light emitting devices
56Processes specially adapted for the manufacture or treatment of OLED
566Division of substrate, e.g. for manufacturing of OLED dsiplays
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Applicants
  • 堺ディスプレイプロダクト株式会社 SAKAI DISPLAY PRODUCTS CORPORATION [JP]/[JP]
Inventors
  • 岸本 克彦 KISHIMOTO, Katsuhiko
  • 西岡 幸也 NISHIOKA, Yukiya
  • 田中 康一 TANAKA, Kohichi
Agents
  • 奥田 誠司 OKUDA Seiji
Priority Data
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD AND APPARATUS FOR MANUFACTURING FLEXIBLE LIGHT-EMITTING DEVICE
(FR) PROCÉDÉ ET APPAREIL DE FABRICATION DE DISPOSITIF LUMINESCENT FLEXIBLE
(JA) フレキシブル発光デバイスの製造方法および製造装置
Abstract
(EN) In a method for manufacturing a flexible light-emitting device according to the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a resin film (30) of a laminated structure (100) are divided, the interface between the flexible substrate region (30d) and a glass base (10) is irradiated with peeling light. The laminated structure (100) is separated into a first portion (110) and a second portion (120) in a state where the laminated structure (100) is in contact with a stage (212). The first portion (110) includes a plurality of light-emitting devices (1000) in contact with the stage (212), and the light-emitting devices (1000) have a plurality of functional layer regions (20) and flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The stage (212) has a discharge hole that is for discharging fluid in a separation step and is in an area opposing the intermediate area (30i).
(FR) Dans un procédé de fabrication d'un dispositif luminescent flexible selon l'invention, après division d'une région intermédiaire (301) et d'une région de substrat flexible (30d) d'un film de résine (30) d'une structure stratifiée (100), l’interface entre la région de substrat flexible (30d) et une base de verre (10) est exposée à un rayonnement de lumière de pelage. La structure stratifiée (100) est séparée en une première partie (110) et en une seconde partie (120) dans un état dans lequel la structure stratifiée (100) est en contact avec un étage (212). La première partie (110) comprend une pluralité de dispositifs luminescents (1000) en contact avec l'étage (212), et les dispositifs luminescents (1000) comprennent une pluralité de régions de couches fonctionnelles (20) et des régions de substrat souple (30d). La seconde partie (120) comprend la base en verre (10) et la région intermédiaire (30i). L'étage (212) comprend un trou d'évacuation qui est destiné à évacuer un fluide dans une étape de séparation et se situe dans une zone opposée à la zone intermédiaire (30i).
(JA) 本開示のフレキシブル発光デバイスの製造方法によれば、積層構造体(100)の樹脂膜(30)の中間領域(30i)とフレキシブル基板領域(30d)とを分割した後、フレキシブル基板領域(30d)とガラスベース(10)との界面を剥離光で照射する。積層構造体(100)をステージ(212)に接触させた状態で、積層構造体(100)を第1部分(110)と第2部分(120)とに分離する。第1部分(110)は、ステージ(212)に接触した複数の発光デバイス(1000)を含み、発光デバイス(1000)は、複数の機能層領域(20)とフレキシブル基板領域(30d)を有する。第2部分(120)は、ガラスベース(10)と中間領域(30i)とを含む。ステージ(212)は、中間領域(30i)に対向する領域に分離工程で流体を噴出する噴出孔を有している。
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