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1. WO2019212590 - AN IOT-BASED SEWAGE TREATMENT SYSTEM

Publication Number WO/2019/212590
Publication Date 07.11.2019
International Application No. PCT/US2018/053112
International Filing Date 27.09.2018
IPC
C02F 1/00 2006.1
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1Treatment of water, waste water, or sewage
C02F 1/02 2006.1
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1Treatment of water, waste water, or sewage
02by heating
C02F 3/00 2006.1
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
3Biological treatment of water, waste water, or sewage
C02F 3/06 2006.1
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
3Biological treatment of water, waste water, or sewage
02Aerobic processes
06using submerged filters
C02F 3/08 2006.1
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
3Biological treatment of water, waste water, or sewage
02Aerobic processes
08using moving contact bodies
C04B 18/00 2006.1
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
18Use of agglomerated or waste materials or refuse as fillers for mortars, concrete or artificial stone; Treatment of agglomerated or waste materials or refuse, specially adapted to enhance their filling properties in mortars, concrete or artificial stone
CPC
C02F 1/008
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1Treatment of water, waste water, or sewage
008Control or steering systems not provided for elsewhere in subclass C02F
C02F 2209/008
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
2209Controlling or monitoring parameters in water treatment
005Processes using a programmable logic controller [PLC]
008comprising telecommunication features, e.g. modems or antennas
C02F 2209/02
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
2209Controlling or monitoring parameters in water treatment
02Temperature
C02F 2209/03
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
2209Controlling or monitoring parameters in water treatment
03Pressure
C02F 2209/06
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
2209Controlling or monitoring parameters in water treatment
06pH
C02F 2209/08
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
2209Controlling or monitoring parameters in water treatment
08Chemical Oxygen Demand [COD]; Biological Oxygen Demand [BOD]
Applicants
  • GUANGDONG UNIVERSITY OF TECHNOLOGY [CN]/[CN] (AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BE, BF, BG, BH, BJ, BN, BW, BY, BZ, CA, CF, CG, CH, CI, CM, CN, CR, CU, CY, CZ, DE, DJ, DK, DM, DO, DZ, EE, EG, ES, FI, FR, GA, GB, GD, GE, GH, GM, GN, GQ, GR, GT, GW, HN, HR, HU, ID, IE, IL, IN, IR, IS, IT, JO, JP, KE, KG, KH, KM, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MC, MD, ME, MG, MK, ML, MN, MR, MT, MW, MX, MY, MZ, NA, NE, NG, NI, NL, NO, NZ, OM, PA, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SI, SK, SL, SM, SN, ST, SV, SY, SZ, TD, TG, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW)
  • GER NORTH AMERICA, LLC [US]/[US] (AG, BB, BR, BZ, CA, CL, CO, CR, CU, DM, DO, EC, GD, GT, HN, LC, MX, NI, PA, PE, TT, US)
Inventors
  • CHAI, Wenguang
Agents
  • WANG, Lingyan
  • DAVID, Sidney
  • MENTLIK, William, L.
  • KRUMHOLZ, Arnold, H.
  • LITTENBERG, Joseph, S.
Priority Data
62/666,91704.05.2018US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) AN IOT-BASED SEWAGE TREATMENT SYSTEM
(FR) UN SYSTÈME DE TRAITEMENT D'EAUX USÉES BASÉ SUR L'IDO
Abstract
(EN) The present invention discloses a filler component based on the Internet of Things (IoT). The filler component includes a main board, a first piece, a second piece, an accessory piece, a plurality of first through holes, and a plurality of second through holes. The main board includes a first curved surface and a second curved surface arranged opposite to each other and that are configured to form a double elliptical cross structure having a cavity. The first piece, the second piece, and the accessory piece are respectively fixed in the cavity of the main board. The first and second pieces are perpendicular to each other, and the accessory piece is parallel to the second piece and perpendicular to the first piece. The plurality of first through holes is arranged on the main board; the plurality of second through holes is arranged on the first piece and/or second piece.
(FR) La présente invention concerne un composant de remplissage basé sur l'Internet des objets (IdO). Le composant de remplissage comprend une carte mère, une première pièce, une seconde pièce, une pièce rapportée, une pluralité de premiers trous débouchants, et une pluralité de seconds trous débouchants. La carte mère comprend une première surface incurvée et une seconde surface incurvée disposées à l'opposé l'une de l'autre et qui sont configurées pour former une double structure transversale elliptique ayant une cavité. La première pièce, la deuxième pièce et la pièce rapportée sont respectivement fixées dans la cavité de la carte mère. Les première et seconde pièces sont perpendiculaires l'une à l'autre, et la pièce rapportée est parallèle à la seconde pièce et perpendiculaire à la première pièce. La pluralité de premiers trous débouchants est disposée sur la carte mère; la pluralité de seconds trous débouchants est disposée sur la première pièce et/ou la seconde pièce.
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