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1. WO2019199212 - WAVEGUIDE LAUNCH

Publication Number WO/2019/199212
Publication Date 17.10.2019
International Application No. PCT/SE2018/050379
International Filing Date 13.04.2018
Chapter 2 Demand Filed 27.01.2020
IPC
H01P 5/107 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5Coupling devices of the waveguide type
08for linking lines or devices of different kinds
10for coupling balanced with unbalanced lines or devices
107Hollow-waveguide/strip-line transitions
H01P 3/08 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
08Microstrips; Strip lines
H01P 3/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
12Hollow waveguides
H05K 1/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
CPC
H01P 5/107
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5Coupling devices of the waveguide type
08for linking dissimilar lines or devices
10for coupling balanced with unbalanced lines or devices
107Hollow-waveguide/strip-line transitions
H05K 1/0225
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0216Reduction of cross-talk, noise or electromagnetic interference
0218by printed shielding conductors, ground planes or power plane
0224Patterned shielding planes, ground planes or power planes
0225Single or multiple openings in a shielding, ground or power plane
H05K 1/0246
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0237High frequency adaptations
0246Termination of transmission lines
H05K 1/144
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
144Stacked arrangements of planar printed circuit boards
H05K 2201/042
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
04Assemblies of printed circuits
042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
H05K 2201/096
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
096Vertically aligned vias, holes or stacked vias
Applicants
  • SAAB AB [SE]/[SE]
Inventors
  • STEN, Gunnarsson
Agents
  • ZACCO SWEDEN AB
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) WAVEGUIDE LAUNCH
(FR) LANCEMENT DE GUIDE D'ONDES
Abstract
(EN)
The present invention concerns a waveguide launch system (1 ) configured for translating radio frequency (RF) signal waves. The system (1 ) comprises a first printed circuit board lamina (5) comprising an electrically conductive ground member (7) and configured for attachment of a separate waveguide element (4), having a first cross-section area (A1 ), thereto. A second printed circuit board lamina (9) comprising an electrically conductive backshort cover (1 1 ) configured to reflect the RF signal waves is bonded to the a first printed circuit board lamina (5). An electrically conductive barrier arrangement (19) extends through the second printed circuit board lamina (9). The electrically conductive barrier arrangement (19) and the electrically conductive backshort cover (1 1 ) form an integrated electrically conductive backshort volume (21 ) of an integrated backshort (22) having a second cross-section area (A2). The second cross-section area (A2) is smaller than the first cross-section area (A1 ).
(FR)
La présente invention concerne un système de lancement de guide d'ondes (1) configuré pour traduire des ondes de signal radiofréquence (RF). Le système comprend une première couche de carte de circuit imprimé (5) comprenant un élément de masse électroconducteur (7) et configuré pour la fixation d'un élément de guide d'ondes séparé (4), ayant une première zone de section transversale (A1 ), à celui-ci. Une seconde couche de carte de circuit imprimé (9) comprenant un couvercle arrière électroconducteur configuré pour réfléchir les ondes de signal RF est liée à la première couche de carte de circuit imprimé (5). Un agencement de barrière électroconducteur (19) s'étend à travers la seconde couche de carte de circuit imprimé (9). L'agencement de barrière électroconductrice (19) et le couvercle arrière électroconducteur forment un volume arrière électroconducteur intégré (21 ) d'un arrière-plan intégré (22) ayant une seconde zone de section transversale (A2). La seconde zone de section transversale (A2) est plus petite que la première zone de section transversale.
Also published as
EP2018914021
Latest bibliographic data on file with the International Bureau