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1. WO2019198190 - PRINTED SUBSTRATE FORMING METHOD, AND PRINTED SUBSTRATE FORMING DEVICE

Publication Number WO/2019/198190
Publication Date 17.10.2019
International Application No. PCT/JP2018/015318
International Filing Date 12.04.2018
IPC
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
CPC
H05K 1/113
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
111Pads for surface mounting, e.g. lay-out
112directly combined with via connections
113Via provided in pad; Pad over filled via
H05K 1/114
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
111Pads for surface mounting, e.g. lay-out
112directly combined with via connections
114Pad being close to via, but not surrounding the via
H05K 1/181
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
181associated with surface mounted components
H05K 2201/09436
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09372Pads and lands
09436Pads or lands on permanent coating which covers the other conductors
H05K 3/125
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using ; thick film techniques, e.g.; printing techniques to apply the conductive material ; or similar techniques for applying conductive paste or ink patterns
1241by ink-jet printing or drawing by dispensing
125by ink-jet printing
H05K 3/1291
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using ; thick film techniques, e.g.; printing techniques to apply the conductive material ; or similar techniques for applying conductive paste or ink patterns
1283After-treatment of the printed patterns, e.g. sintering or curing methods
1291Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
Applicants
  • 株式会社FUJI FUJI CORPORATION [JP]/[JP]
Inventors
  • 富永 亮二郎 TOMINAGA, Ryojiro
Agents
  • 特許業務法人ネクスト NEXT INTERNATIONAL
  • 片岡 友希 KATAOKA, Tomoki
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PRINTED SUBSTRATE FORMING METHOD, AND PRINTED SUBSTRATE FORMING DEVICE
(FR) PROCÉDÉ DE FORMATION DE SUBSTRAT IMPRIMÉ ET DISPOSITIF DE FORMATION DE SUBSTRAT IMPRIMÉ
(JA) プリント基板形成方法、およびプリント基板形成装置
Abstract
(EN)
This printed substrate forming method includes: a resin layer forming step for forming, with a curable resin, a resin layer in a specified region which is a region other than a prescribed region of a base, a solder resist being formed on the prescribed region of the base which comprises an insulative layer and a conductive layer; and a wiring forming step for forming wiring by discharging a metal-containing liquid that contains metal fine particles onto the surface of the resin layer, and firing the metal-containing particles.
(FR)
La présente invention concerne un procédé de formation de substrat imprimé comprenant : une étape de formation de couche de résine pour former, avec une résine durcissable, une couche de résine dans une région spécifiée qui est une région autre qu'une région prescrite d'une base, une réserve de soudure étant formée sur la région prescrite de la base qui comprend une couche isolante et une couche conductrice ; et une étape de formation de câblage pour former un câblage par décharge d'un liquide contenant du métal qui contient des particules fines de métal sur la surface de la couche de résine, et par cuisson des particules contenant du métal.
(JA)
絶縁層と導体層とにより構成されたベースの所定の領域にソルダーレジストが形成されており、ベースの所定の領域以外の領域である特定領域に、硬化性樹脂により樹脂層を形成する樹脂層形成工程と、金属微粒子を含有する金属含有液を樹脂層の表面に吐出し、金属含有液を焼成することで配線を形成する配線形成工程とを含むプリント基板形成方法。
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