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1. WO2019181652 - POROUS PAD, VACUUM CHUCK DEVICE, AND PLANE FORMING METHOD FOR POROUS PAD

Publication Number WO/2019/181652
Publication Date 26.09.2019
International Application No. PCT/JP2019/010019
International Filing Date 12.03.2019
IPC
H01L 21/683 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
B23Q 3/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL, CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
3Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine
02for mounting on a work-table, tool-slide, or analogous part
06Work-clamping means
08other than mechanically-actuated
B24B 41/06 2012.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
41Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks
06Work supports, e.g. adjustable steadies
B25B 11/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING
11Work holders or positioners not covered by groups B25B1/-B25B9/102
CPC
B23Q 3/08
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING
3Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
02for mounting on a work-table, tool-slide, or analogous part
06Work-clamping means
08other than mechanically-actuated
B24B 41/06
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
41Component parts such as frames, beds, carriages, headstocks
06Work supports, e.g. adjustable steadies
B25B 11/00
BPERFORMING OPERATIONS; TRANSPORTING
25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
11Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
Applicants
  • 株式会社ナノテム NANO TEM CO., LTD. [JP]/[JP]
Inventors
  • ▲高▼田 篤 TAKATA Atsushi
  • ▲高▼田 久寿 TAKATA Hisatoshi
  • 大橋 恭介 OHASHI Kyosuke
Agents
  • 木村 満 KIMURA Mitsuru
Priority Data
2018-05569323.03.2018JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) POROUS PAD, VACUUM CHUCK DEVICE, AND PLANE FORMING METHOD FOR POROUS PAD
(FR) TAMPON POREUX, DISPOSITIF DE MANDRIN À VIDE ET PROCÉDÉ DE FORMATION DE PLAN POUR TAMPON POREUX
(JA) 多孔質パッド、真空チャック装置及び多孔質パッドの平面形成方法
Abstract
(EN) This porous pad (20) is provided with: a porous ceramic portion (25) having formed a plurality of pores providing permeability to allow for passage of a fluid; and an antislip portion (27) which is formed on the porous ceramic portion (25) so as to contact a part of a work (W) as an example of an object to be mounted that is mounted on the porous ceramic portion (25), and which has a static coefficient of friction higher than that of the porous ceramic portion (25).
(FR) L'invention concerne un tampon poreux (20) comprenant : une partie céramique poreuse (25) ayant formé une pluralité de pores fournissant une perméabilité pour permettre le passage d'un fluide ; et une partie anti-glissement (27) qui est formée sur la partie céramique poreuse (25) de façon à entrer en contact avec une partie d'une piece (W) comme un exemple d'un objet à monter qui est monté sur la partie en céramique poreuse (25), et qui a un coefficient de frottement statique supérieur à celui de la partie en céramique poreuse (25).
(JA) 多孔質パッド(20)は、複数の気孔が形成されることにより流体を通過させる通気性を有する多孔質セラミック部(25)と、多孔質セラミック部(25)に設置される設置対象物の一例であるワーク(W)の一部に接触するように多孔質セラミック部(25)に形成され、多孔質セラミック部(25)よりも高い静摩擦係数を有する滑り止め部(27)と、を備える。
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