Processing

Please wait...

Settings

Settings

Goto Application

1. WO2019172336 - LIGHT EMITTING ELEMENT MOUNTING SUBSTRATE AND LIGHT EMITTING DEVICE

Publication Number WO/2019/172336
Publication Date 12.09.2019
International Application No. PCT/JP2019/008944
International Filing Date 06.03.2019
IPC
H01S 5/022 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
H01L 23/12 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 23/13 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
13characterised by the shape
H05K 3/46 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H01L 33/486
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
483Containers
486adapted for surface mounting
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
H01S 5/023
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
023Mount members, e.g. sub-mount members
H01S 5/0233
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0233Mounting configuration of laser chips
H01S 5/0235
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0235Method for mounting laser chips
H01S 5/0237
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0235Method for mounting laser chips
02355Fixing laser chips on mounts
0237by soldering
Applicants
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP]
Inventors
  • 古久保 洋二 FURUKUBO, Youji
  • 案浦 雅徳 ANNOURA, Masanori
  • 川上 武 KAWAKAMI, Takeshi
Agents
  • 特許業務法人酒井国際特許事務所 SAKAI INTERNATIONAL PATENT OFFICE
Priority Data
2018-04216508.03.2018JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIGHT EMITTING ELEMENT MOUNTING SUBSTRATE AND LIGHT EMITTING DEVICE
(FR) SUBSTRAT DE MONTAGE D'ÉLÉMENT ÉLECTROLUMINESCENT ET DISPOSITIF ÉLECTROLUMINESCENT
(JA) 発光素子搭載用基板および発光装置
Abstract
(EN) This light emitting element mounting substrate (A1) is provided with: a substrate (10) which is configured from a ceramic; a terminal (11a) for elements, which is provided on a front surface (10a) of the substrate (10), and on which a light emitting element (30) is mounted; a terminal (12a) for power supplies, which is provided on the substrate (10), and to which an external power supply is connected; and a wiring part (14a) which is provided within the substrate (10), and which electrically connects the terminal (11a) for elements and the terminal (12a) for power supplies to each other. The wiring part (14a) comprises: a first conductor (15a) which extends in the plane direction of the substrate (10); and a second conductor (16a) which extends generally parallel to the first conductor (15a) on the far side from the front surface (10a), and which is connected in parallel with the first conductor (15a).
(FR) L'invention concerne un substrat de montage d'élément électroluminescent (A1) comportant : un substrat (10) qui est conçu à partir d'une céramique ; une borne (11a) pour des éléments, qui est disposée sur une surface avant (10a) du substrat (10), et sur laquelle est monté un élément électroluminescent (30) ; une borne (12a) pour des alimentations électriques, qui est disposée sur le substrat (10), et à laquelle une alimentation électrique externe est connectée ; et une partie de câblage (14a) qui est disposée à l'intérieur du substrat (10), et qui connecte électriquement la borne (11a) pour des éléments et la borne (12a) pour des alimentations électriques l'une à l'autre. La partie de câblage (14a) comprend : un premier conducteur (15a) qui s'étend dans la direction du plan du substrat (10) ; et un second conducteur (16a) qui s'étend généralement parallèlement au premier conducteur (15a) sur le côté éloigné de la surface avant (10a), et qui est connecté en parallèle au premier conducteur (15a).
(JA) 発光素子搭載用基板(A1)は、セラミックスで構成される基板(10)と、基板(10)のおもて面(10a)に設けられ、発光素子(30)が搭載される素子用端子(11a)と、基板(10)に設けられ、外部電源が接続される電源用端子(12a)と、基板(10)の内部に設けられ、素子用端子(11a)と電源用端子(12a)を電気的に接続する配線部(14a)と、を備える。また、配線部(14a)は、基板(10)の面方向に延びる第1導体(15a)と、第1導体(15a)に対しておもて面(10a)とは反対側に略平行に延び、第1導体(15a)と並列に接続される第2導体(16a)と、を有する。
Latest bibliographic data on file with the International Bureau