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1. WO2019114699 - PACKAGE STRUCTURE, SUBSTRATE AND DISPLAY PANEL

Publication Number WO/2019/114699
Publication Date 20.06.2019
International Application No. PCT/CN2018/120315
International Filing Date 11.12.2018
IPC
H01L 51/56 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 27/3246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3246Pixel defining structures, e.g. banks
H01L 27/3258
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3258Insulating layers formed between TFT elements and OLED elements
H01L 51/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
H01L 51/5253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
5253Protective coatings
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 成都京东方光电科技有限公司 CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 乔梓 QIAO, Zi
  • 蒋志亮 JIANG, Zhiliang
Agents
  • 北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES
Priority Data
201711353503.715.12.2017CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) PACKAGE STRUCTURE, SUBSTRATE AND DISPLAY PANEL
(FR) STRUCTURE D'EMBALLAGE, SUBSTRAT ET PANNEAU D'AFFICHAGE
(ZH) 封装结构、基板和显示面板
Abstract
(EN) A package structure, a substrate, and a display panel. The package structure (10) comprises a package layer and a transition layer (400); the package layer includes a first package layer (100) and a second package layer (200) that are stacked one above the other, the first package layer (100) being located on a first main surface (210) of the second package layer (200); the transition layer (400) and the first package layer (100) are disposed in parallel on the first main surface (210); the first main surface (210) includes a first region (211) in contact with the first package layer (100) and a second region (212) in contact with the transition layer (400); the second region (212) is located at an edge of the first main surface (210); and the bonding strength between the transition layer (400) and the second package layer (200) is greater than the bonding strength between the first package layer (100) and the second package layer (200). The transition layer can improve the adhesive force of the edge portion of the second package layer, prevent the separation of the second package layer, and improve the package yield.
(FR) La présente invention concerne une structure d'emballage, un substrat, et un panneau d'affichage. La structure d'emballage (10) comprend une couche d'emballage et une couche de transition (400) ; la couche d'emballage comprend une première couche d'emballage (100) et une seconde couche d'emballage (200) qui sont empilées l'une au-dessus de l'autre, la première couche d'emballage (100) étant située sur une première surface principale (210) de la seconde couche d'emballage (200) ; la couche de transition (400) et la première couche d'emballage (100) sont disposées en parallèle sur la première surface principale (210) ; la première surface principale (210) comprend une première région (211) en contact avec la première couche d'emballage (100) et une seconde région (212) en contact avec la couche de transition (400) ; la seconde région (212) est située au niveau d'un bord de la première surface principale (210) ; et la force de liaison entre la couche de transition (400) et la seconde couche d'emballage (200) est supérieure à la force de liaison entre la première couche d'emballage (100) et la seconde couche d'emballage (200). La couche de transition peut améliorer la force adhésive de la partie de bord de la seconde couche d'emballage, empêcher la séparation de la seconde couche d'emballage, et améliorer le rendement de l'emballage.
(ZH) 一种封装结构、基板和显示面板。该封装结构(10)包括封装层和过渡层(400),该封装层包括彼此层叠设置的第一封装层(100)和第二封装层(200),第一封装层(100)位于第二封装层(200)的第一主表面(210)上,过渡层(400)与第一封装层(100)并列设置于第一主表面(210)上,第一主表面(210)包括与第一封装层(100)接触的第一区域(211)和与过渡层(400)接触的第二区域(212),第二区域(212)位于第一主表面(210)的边缘,并且过渡层(400)和第二封装层(200)之间的结合强度大于第一封装层(100)和第二封装层(200)之间的结合强度。该过渡层可以提升第二封装层的边缘部分的附着力,防止第二封装层分离,提升封装良率。
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