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1. (WO2019078229) PLATING METHOD, AIR-BUBBLE JETTING MEMBER, PLATING DEVICE, AND DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/078229 International Application No.: PCT/JP2018/038580
Publication Date: 25.04.2019 International Filing Date: 17.10.2018
IPC:
C25D 5/02 (2006.01) ,C23C 18/31 (2006.01) ,C23C 24/02 (2006.01) ,C25D 7/00 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
02
Electroplating of selected surface areas
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
24
Coating starting from inorganic powder
02
by application of pressure only
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
Applicants:
国立大学法人九州大学 KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION [JP/JP]; 福岡県福岡市西区元岡744 744, Motooka, Nishi-ku, Fukuoka-shi, Fukuoka 8190395, JP
Inventors:
山西 陽子 YAMANISHI Yoko; JP
福山 雄大 FUKUYAMA Yudai; JP
市川 啓太 ICHIKAWA Keita; JP
Agent:
松本 征二 MATSUMOTO Seiji; JP
Priority Data:
2017-20299419.10.2017JP
Title (EN) PLATING METHOD, AIR-BUBBLE JETTING MEMBER, PLATING DEVICE, AND DEVICE
(FR) PROCÉDÉ DE PLACAGE, ÉLÉMENT DE PROJECTION DE BULLES D'AIR, DISPOSITIF DE PLACAGE ET DISPOSITIF
(JA) めっき方法、気泡噴出部材、めっき装置、および、デバイス
Abstract:
(EN) The present invention addresses the problem of providing a method capable of plating various kinds of objects to be plated at predetermined positions without any pretreatment. The problem can be solved by a method for plating an object to be plated by using a plating solution, the method including at least an air-bubble jetting step for jetting air-bubbles generated by an air-bubble jetting member to the plating solution, wherein the air-bubble jetting member includes an electrode made of an electroconductive material and an insulating material covering at least part of the electrode, and is configured such that at least part of the insulating material forms an air-bubble jetting port, and a space covered by the insulating material is formed between at least part of the electrode and the air-bubble jetting port.
(FR) La présente invention concerne un procédé permettant de plaquer divers types d'objets à plaquer dans des positions prédéterminées sans prétraitement. Plus particulièrement, l'invention concerne un procédé de placage d'un objet à plaquer à l'aide d'une solution de placage, le procédé comprenant au moins une étape de projection de bulles d'air consistant à projeter des bulles d'air générées par un élément de projection de bulles d'air vers la solution de placage, l'élément de projection de bulles d'air comprenant une électrode constituée d'un matériau conducteur électrique et un matériau isolant recouvrant au moins une partie de l'électrode, et étant configuré de telle sorte qu'au moins une partie du matériau isolant forme un orifice de projection de bulles d'air, et un espace couvert par le matériau isolant étant formé entre au moins une partie de l'électrode et l'orifice de projection de bulles d'air.
(JA) 多様なめっき対象物に前処理を実施することなく、所定の位置にめっきできる方法を提供することを課題とする。 めっき液を用いためっき対象物へのめっき方法であって、 該めっき方法は、 気泡噴出部材で生成した気泡をめっき液に噴出する気泡噴出工程、 を少なくとも含み、 気泡噴出部材は、 導電材料で形成された電極、及び、 電極の少なくとも一部を覆う絶縁材料、 を含み、 絶縁材料の少なくとも一部は気泡噴出口を形成し、電極の少なくとも一部と気泡噴出口の間には絶縁材料で覆われた空隙が形成されている、 めっき方法により、課題を解決できる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)