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1. WO2019077144 - METHOD FOR MANUFACTURING A MICROSTRUCTURED DEVICE AND ASSOCIATED IMPLEMENTATION DEVICES

Publication Number WO/2019/077144
Publication Date 25.04.2019
International Application No. PCT/EP2018/078796
International Filing Date 19.10.2018
IPC
B81C 99/00 2010.1
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
99Subject matter not provided for in other groups of this subclass
B81C 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81B 2201/058
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
05Microfluidics
058Microfluidics not provided for in B81B2201/051 - B81B2201/054
B81C 2201/0184
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2201Manufacture or treatment of microstructural devices or systems
01in or on a substrate
0174for making multi-layered devices, film deposition or growing
0183Selective deposition
0184Digital lithography, e.g. using an inkjet print-head
B81C 2201/034
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2201Manufacture or treatment of microstructural devices or systems
03Processes for manufacturing substrate-free structures
034Moulding
B81C 99/009
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
99Subject matter not provided for in other groups of this subclass
0075Manufacture of substrate-free structures
009Manufacturing the stamps or the moulds
Applicants
  • COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES [FR]/[FR]
  • UNIVERSITE DE VERSAILLES SAINT-QUENTIN-EN-YVELINES [FR]/[FR]
Inventors
  • MALLOGGI, Florent
  • BROSSARD, Rémy
Agents
  • GEVERS & ORES
Priority Data
175983219.10.2017FR
Publication Language French (fr)
Filing Language French (FR)
Designated States
Title
(EN) METHOD FOR MANUFACTURING A MICROSTRUCTURED DEVICE AND ASSOCIATED IMPLEMENTATION DEVICES
(FR) PROCEDE DE FABRICATION D'UN DISPOSITIF MICROSTRUCTURE ET DISPOSITIFS DE MISE EN ŒUVRE ASSOCIES
Abstract
(EN) The invention relates to a method for manufacturing a microstructured device comprising the following steps: a) supplying a substrate; b) printing a non-solid ink on the substrate, the ink solidifying in contact with the substrate in order to form a negative pattern of at least one microstructure of the microstructured device to be manufactured; c) covering the ink in solid form with a polymer that is non-crosslinked and comprises an additive able to allow crosslinking of said polymer, said polymer being immiscible with the pattern obtained in step b) in order to form a cover for the pattern, said polymer having a melting temperature that is strictly greater than the sublimation or evaporation temperature of the ink forming the pattern; d) crosslinking the cover; then e) subliming or, depending on the type of ink, liquefying then evaporating the ink so as to form the microstructured device comprising said at least one microstructure. The invention also relates to devices for implementing the method according to the invention.
(FR) L'invention concerne un procédé de fabrication d'un dispositif micro structuré comprenant les étapes suivantes : a) fournir un substrat; b) imprimer une encre, non solide, sur le substrat, l'encre se solidifiant au contact du substrat pour former un motif en négatif d'au moins une microstructure du dispositif microstructuré à fabriquer; c) envelopper l'encre sous forme solide avec un polymère non réticulé et comportant un additif apte à permettre une réticulation dudit polymère, ledit polymère étant non miscible avec le motif obtenu à l'étape b) afin de former une enveloppe pour le motif, ledit polymère présentant une température de fusion strictement supérieure à la température de sublimation ou d'évaporation de l'encre formant le motif; d) réticuler l'enveloppe; puis e) sublimer ou, selon la nature de l'encre, liquéfier puis évaporer l'encre de sorte à former le dispositif microstructuré comportant ladite au moins une micro structure. L'invention concerne également des dispositifs de mise en œuvre du procédé selon l'invention.
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