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1. (WO2019068094) RESISTIVE RANDOM ACCESS MEMORY AND FABRICATION TECHNIQUES
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Pub. No.: WO/2019/068094 International Application No.: PCT/US2018/053780
Publication Date: 04.04.2019 International Filing Date: 01.10.2018
IPC:
H01L 45/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
45
Solid state devices specially adapted for rectifying, amplifying, oscillating, or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
Applicants:
CROSSBAR, INC. [US/US]; 3200 Patrick Henry Drive, Suite 110 Santa Clara, California 95054, US
Inventors:
JO, Sung-Hyun; US
NARAYANAN, Sundar; US
GU, Zhen; US
Agent:
CHO, Steve Y.; US
Priority Data:
62/566,15429.09.2017US
Title (EN) RESISTIVE RANDOM ACCESS MEMORY AND FABRICATION TECHNIQUES
(FR) MÉMOIRE VIVE RÉSISTIVE ET TECHNIQUES DE FABRICATION
Abstract:
(EN) A self-aligned memory device includes a conductive bottom plug disposed within an insulating layer and having a coplanar top surface, a self-aligned planar bottom electrode disposed upon the coplanar top surface and having a thickness within a range of 50 Angstroms to 200 Angstroms, a planar switching material layer disposed upon the self-aligned planar bottom electrode, a planar active metal material layer disposed upon the planar switching material layer and a planar top electrode disposed above the planar active metal material layer, wherein the self-aligned planar bottom electrode, the planar switching material layer, the planar active metal material layer, and the planar top electrode form a pillar-like structure above the insulating layer.
(FR) L'invention concerne un dispositif de mémoire auto-aligné comprenant une fiche inférieure conductrice, disposée à l'intérieur d'une couche isolante et ayant une surface supérieure coplanaire, une électrode inférieure plane auto-alignée, disposée sur la surface supérieure coplanaire et ayant une épaisseur dans une plage de 50 angströms à 200 angströms, une couche plane de matériau de commutation, disposée sur l'électrode inférieure plane auto-alignée, une couche plane de matériau métallique actif, disposée sur la couche plane de matériau de commutation et une électrode supérieure plane, disposée au-dessus de la couche plane de matériau métallique actif, l'électrode inférieure plane auto-alignée, la couche plane de matériau de commutation, la couche plane de matériau métallique actif et l'électrode supérieure plane formant une structure de type pilier au-dessus de la couche isolante.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)