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1. (WO2019067806) MULTI-VIA STRUCTURES FOR TOUCHSCREENS
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Pub. No.: WO/2019/067806 International Application No.: PCT/US2018/053248
Publication Date: 04.04.2019 International Filing Date: 27.09.2018
IPC:
G06F 3/041 (2006.01) ,G06F 3/044 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
044
by capacitive means
Applicants:
APPLE INC. [UY/US]; One Apple Park Way Cupertino, California 95014, US
Inventors:
SCHULTZ, David Sheldon; US
SHARMA, Prithu; US
GAUBERT, Zachary M.; US
Agent:
STEVENS, Sarah; US
Priority Data:
62/565,53129.09.2017US
Title (EN) MULTI-VIA STRUCTURES FOR TOUCHSCREENS
(FR) STRUCTURES À TROUS D'INTERCONNEXION MULTIPLES POUR ÉCRANS TACTILES
Abstract:
(EN) The disclosure relates to a touch screen including a first electrode layer, a second electrode layer, and a third electrode layer. The touch screen can include shield-sensor vias connecting tlie first electrode layer and the second electrode layer and shield-shield vias connecting the first electrode layer and the third electrode layer, for example. The shield-sensor vias can be placed in a bond pad region of the touch screen, which can further include connections between one or more routing traces connected to one or more touch electrodes and touch or other circuitry further included in the electronic device. The shield-shield vias can be placed in an outer region located around an inner region of the touch screen. In some examples, one or more routing traces can include diverted portions to maintain a threshold distance between the routing traces and the one or more shield-shield vias.
(FR) L'invention concerne un écran tactile comprenant une première couche d'électrode, une seconde couche d'électrode et une troisième couche d'électrode. L'écran tactile peut comprendre des trous d'interconnexion capteur-blindage connectant la première couche d'électrode et la deuxième couche d'électrode et des trous d'interconnexion blindage-blindage reliant la première couche d'électrode et la troisième couche d'électrode, par exemple. Les trous d'interconnexion capteur-blindage peuvent être placés dans une région de plot de connexion de l'écran tactile, qui peut en outre comprendre des connexions entre une ou plusieurs traces de routage connectées à une ou plusieurs électrodes tactiles et à un système de circuits tactile ou autre inclus en outre dans le dispositif électronique. Les trous d'interconnexion blindage-blindage peuvent être placés dans une région externe située autour d'une région interne de l'écran tactile. Dans certains exemples, une ou plusieurs traces de routage peuvent comprendre des parties déviées pour maintenir une distance seuil entre les traces de routage et le ou les trous d'interconnexion blindage-blindage.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)