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1. (WO2019067755) COMPACT MEASUREMENT DEVICE CONFIGURATION FOR INTEGRATING COMPLEX CIRCUITS
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Pub. No.: WO/2019/067755 International Application No.: PCT/US2018/053176
Publication Date: 04.04.2019 International Filing Date: 27.09.2018
IPC:
G01B 5/008 (2006.01) ,G01B 5/00 (2006.01) ,G01B 11/02 (2006.01) ,G01B 11/03 (2006.01) ,G01B 21/04 (2006.01) ,G01S 7/481 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
5
Measuring arrangements characterised by the use of mechanical means
08
for measuring diameters
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
5
Measuring arrangements characterised by the use of mechanical means
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
02
for measuring length, width, or thickness
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
02
for measuring length, width, or thickness
03
by measuring coordinates of points
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
21
Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the other groups of this subclass
02
for measuring length, width, or thickness
04
by measuring coordinates of points
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
7
Details of systems according to groups G01S13/, G01S15/, G01S17/127
48
of systems according to group G01S17/58
481
Constructional features, e.g. arrangements of optical elements
Applicants:
MITUTOYO CORPORATION [JP/JP]; 20-1, Sakado 1-Chome, Takatsu-ku Kawasaki-shi, Kanagawa-ken 213-8533, JP
Inventors:
QI, Bernadette, Baqui; US
WISSNER, Richard, Alan; US
Agent:
LEEK, Shoko, I.; US
OBEIDAT, Baha, A.; US
KUMABE, Blake, K.; US
SOLTANI, Bobby, B.; US
ZENTZ, Bradley, J.; US
SARGEANT, Brooke; US
QUIST, Brooke, W.; US
O'BRIEN, Daniel; US
ROTH, Carol, J.; US
EIDT, Chandra, E.; US
STARK, Duncan; US
CARLSON, David, V.; US
TARLETON, E., Russell; US
SUN, Eileen, S.; US
HARWOOD, Eric, A.; US
GERTZ, Glenda, A.; US
HAN, Hai; US
TALBERT, Hayley, J.; US
WHITE, James, A. D.; US
BARRETT, Jared, M.; US
PEPE, Jeffrey, C.; US
DANLEY, Jeffrey, E.; US
SAKOI, Jeffrey, M.; US
BAUNACH, Jeremiah, J.; US
KARLEN, John, R.; US
MORGAN, John, A.; US
WAKELEY, John, J.; US
COE, Justin, E.; US
HENCKEL, Karen, M.; US
HEFTER, Karl, A.; US
HERMANNS, Karl, R.; US
MORGAN, Kevan, L.; US
COSTANZA, Kevin, S.; US
COOPER, Michael, P.; US
RUSYN, Paul; US
LIN, Qing; US
HALLER, Rachel, A.; US
IANNUCCI, Robert; US
WEBB, Samuel, E.; US
ROSENMAN, Stephen, J.; US
ABEDI, Syed; US
SHEWMAKE, Thomas, A.; US
SATAGAJ, Thomas, J.; US
BOLLER, Timothy, L.; US
LIGON, Toby, J.; US
CANTRELL, Tyler, C.; US
FERRON, William, O., Jr.; US
Priority Data:
62/565,96129.09.2017US
Title (EN) COMPACT MEASUREMENT DEVICE CONFIGURATION FOR INTEGRATING COMPLEX CIRCUITS
(FR) CONFIGURATION DE DISPOSITIF DE MESURE COMPACT POUR INTÉGRER DES CIRCUITS COMPLEXES
Abstract:
(EN) A compact coordinate measuring machine (CMM) probe configuration is provided for integrating complex circuits into a CMM probe. The CMM probe configuration includes a stylus position detection portion, a stylus suspension portion and a circuit board assembly. The stylus position detection portion includes an alignment frame and an optical sensing configuration. The circuit board assembly includes a rigid flex circuit element and a three dimensional carrier frame. The rigid flex circuit element includes a set of board portions joined by a set of flexible bend portions. The rigid flex circuit element is folded at the bend portions to locate some of the board portions to be proximate to and/or joined to corresponding support surfaces on the carrier frame. The circuit board assembly at least partially surrounds a majority of the stylus position detection portion and is joined thereto with the carrier frame fixed relative to the alignment frame.
(FR) La présente invention concerne une configuration de sonde de machine de mesure de coordonnées compacte (CMM) pour intégrer des circuits complexes dans une sonde de CMM. La configuration de sonde de CMM comprend une partie de détection de position de stylet, une partie de suspension de stylet et un ensemble de carte de circuit imprimé. La partie de détection de position de stylet comprend un cadre d'alignement et une configuration de détection optique. L'ensemble de carte de circuit imprimé comprend un élément de circuit flexible rigide et un cadre de support tridimensionnel. L'élément de circuit flexible rigide comprend un ensemble de parties de carte assemblées par un ensemble de parties de courbure flexibles. L'élément de circuit flexible rigide est plié au niveau des parties de courbure pour localiser certaines des parties de carte à proximité de, et/ou assemblées à des surfaces de support correspondantes sur le cadre de support. L'ensemble de carte de circuit imprimé entoure au moins partiellement la majorité de la partie de détection de position de stylet et est assemblé à celle-ci avec le cadre de support fixé par rapport au cadre d'alignement.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)