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1. (WO2019067128) METHODS AND APPARATUS FOR MONITORING ROBOT HEALTH IN MANUFACTURING ENVIRONMENTS
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Pub. No.: WO/2019/067128 International Application No.: PCT/US2018/048114
Publication Date: 04.04.2019 International Filing Date: 27.08.2018
IPC:
H01L 21/67 (2006.01) ,H01L 21/66 (2006.01) ,H01L 21/677 (2006.01) ,H01L 21/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
CHATTOPADHYAY, Rita; US
CHETTY, Mruthunjaya; US
DAVIS, Jeffrey; US
JI, Xiaozhong; US
COPE, Stephanie; US
Agent:
DUBE, Brandon J.; US
Priority Data:
15/721,47329.09.2017US
Title (EN) METHODS AND APPARATUS FOR MONITORING ROBOT HEALTH IN MANUFACTURING ENVIRONMENTS
(FR) PROCÉDÉS ET APPAREILS DE SURVEILLANCE DE SANTÉ DE ROBOT DANS DES ENVIRONNEMENTS DE FABRICATION
Abstract:
(EN) Methods, apparatus, systems, and articles of manufacture for monitoring robot health in manufacturing environments are described herein. An example system, to monitor health of a robot in a semiconductor wafer manufacturing facility, includes a sensor coupled to the robot. The sensor is to obtain a vibration signal representative of vibration of the robot. The example system also includes a health monitor extract a feature from the vibration signal, compare the feature to a threshold, and, in response to determining the feature satisfies the threshold, transmit an alert.
(FR) L'invention concerne des procédés, des appareils, des systèmes et des produits manufacturés pour surveiller la santé d'un robot dans des environnements de fabrication. Un système donné à titre d'exemple, pour surveiller la santé d'un robot dans une installation de fabrication de tranches de semi-conducteur, comprend un capteur couplé au robot. Le capteur est destiné à obtenir un signal de vibration représentant une vibration du robot. Le système donné à titre d'exemple comprend également un dispositif de surveillance de santé pour extraire une caractéristique du signal de vibration, comparer la caractéristique à un seuil, et, en réponse à la détermination du fait que la caractéristique satisfait le seuil, transmettre une alerte.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)