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1. (WO2019067039) FABRICATION OF APPARATUS INCLUDING SUPERCONDUCTING WIRING LAYERS AND INTERCONNECTS
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Pub. No.: WO/2019/067039 International Application No.: PCT/US2018/039214
Publication Date: 04.04.2019 International Filing Date: 25.06.2018
IPC:
H01L 21/768 (2006.01) ,H01L 39/24 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39
Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
24
Processes or apparatus specially adapted for the manufacture or treatment of devices provided for in group H01L39/135
Applicants:
MICROSOFT TECHNOLOGY LICENSING, LLC [US/US]; One Microsoft Way Redmond, Washington 98052-6399, US
Inventors:
ROUSE, Richard P.; US
TUCKERMAN, David B.; US
Agent:
MINHAS, Sandip S.; US
CHEN, Wei-Chen Nicholas; US
HINOJOSA, Brianna L.; US
HOLMES, Danielle J.; US
SWAIN, Cassandra T.; US
WONG, Thomas S.; US
CHOI, Daniel; US
HWANG, William C.; US
WIGHT, Stephen A.; US
CHATTERJEE, Aaron C.; US
JARDINE, John S.; US
GOLDSMITH, Micah P.; US
Priority Data:
15/715,52126.09.2017US
Title (EN) FABRICATION OF APPARATUS INCLUDING SUPERCONDUCTING WIRING LAYERS AND INTERCONNECTS
(FR) FABRICATION D'APPAREIL COMPRENANT DES COUCHES DE CÂBLAGE SUPRACONDUCTRICES ET DES INTERCONNEXIONS
Abstract:
(EN) A superconducting apparatus is formed by depositing a first dielectric material (104) on a substrate (102) and curing the first dielectric material at a first temperature, forming a first superconducting layer comprising a first set of patterned superconducting traces (106) on the first dielectric layer, depositing a second dielectric material (108) on the first superconducting layer and curing the second dielectric material at a second temperature which is lower than the first temperature, and forming a second superconducting layer comprising a second set of patterned superconducting traces (114, 116, 118) on the second dielectric layer.
(FR) La présente invention concerne un appareil supraconducteur formé en déposant un premier matériau diélectrique (104) sur un substrat (102) et en durcissant le premier matériau diélectrique à une première température, en formant une première couche supraconductrice comprenant un premier ensemble de traces supraconductrices à motifs (106) sur la première couche diélectrique, en déposant un second matériau diélectrique (108) sur la première couche supraconductrice et en durcissant le second matériau diélectrique à une seconde température qui est inférieure à la première température, et en formant une seconde couche supraconductrice comprenant un second ensemble de traces supraconductrices à motifs (114, 116, 118) sur la seconde couche diélectrique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)