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1. (WO2019066968) STRUCTURES FOR CONDUCTING HEAT WITH A PACKAGED DEVICE AND METHOD OF PROVIDING SAME
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Pub. No.: WO/2019/066968 International Application No.: PCT/US2017/054618
Publication Date: 04.04.2019 International Filing Date: 29.09.2017
IPC:
H01L 23/367 (2006.01) ,H01L 23/31 (2006.01) ,H01L 23/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard SANTA CLARA, California 95054, US
Inventors:
GOMES, Wilfred; US
MAHAJAN, Ravindranath V.; US
VISWANATH, Ram S.; US
Agent:
CONINGSBY, Donna Jo; US
MALLIE, Michael J.; US
VINCENT, Lester J.; US
Priority Data:
Title (EN) STRUCTURES FOR CONDUCTING HEAT WITH A PACKAGED DEVICE AND METHOD OF PROVIDING SAME
(FR) STRUCTURES PERMETTANT DE CONDUIRE DE LA CHALEUR AU MOYEN D'UN DISPOSITIF SOUS BOÎTIER ET LEUR PROCÉDÉ D'OBTENTION
Abstract:
(EN) Techniques and mechanisms for conducting heat with a packaged integrated circuit (IC) device. In an embodiment, the IC device comprises a package substrate and one or more IC dies coupled thereto, where a thermal conductor of the IC device extends through the package substrate. A thermal conductivity of the thermal conductor is more than 20 Watts per meter per degree Kelvin (W/mK). In another embodiment, thermal conductor further extends at least partially through a mold compound disposed on the one or more IC dies.
(FR) L'invention concerne des techniques et des mécanismes permettant de conduire de la chaleur au moyen d'un dispositif à circuit intégré (CI) sous boîtier. Dans un mode de réalisation, le dispositif à CI comprend un substrat de boîtier et une ou plusieurs puces à CI couplées à ce dernier, un conducteur thermique du dispositif à CI s'étendant à travers le substrat de boîtier. La conductivité thermique du conducteur thermique est supérieure à 20 Watts par mètre par degré Kelvin (W/mK). Dans un autre mode de réalisation, le conducteur thermique se prolonge au moins partiellement dans un composé de moule disposé sur lesdites puces à CI.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)