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1. (WO2019066952) TUNABLE PASSIVE SEMICONDUCTOR ELEMENTS
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Pub. No.: WO/2019/066952 International Application No.: PCT/US2017/054564
Publication Date: 04.04.2019 International Filing Date: 29.09.2017
IPC:
H01L 25/07 (2006.01) ,H01L 23/498 (2006.01) ,H01L 23/00 (2006.01) ,H01L 25/16 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Blvd Santa Clara, California 95054, US
Inventors:
ZHANG, Zhichao; US
AYGUN, Kemal; US
MEKONNEN, Yidnekachew S.; US
Agent:
CZARNECKI, Michael S.; US
Priority Data:
Title (EN) TUNABLE PASSIVE SEMICONDUCTOR ELEMENTS
(FR) ÉLÉMENTS À SEMI-CONDUCTEUR PASSIFS ACCORDABLES
Abstract:
(EN) Passive semiconductor components and switches may be formed directly in, on, about, or across each of two or more semiconductor dies included in a stacked-die semiconductor package. At least some of the passive semiconductor components and/or switches may be formed in redistribution layers operably coupled to corresponding semiconductor dies included in the stacked-die semiconductor package. The switches may have multiple operating states and may be operably coupled to the passive semiconductor components such that one or more passive semiconductor components may be selectively included in one or more circuits or excluded from one or more circuits. The switches may be manually controlled or autonomously controlled using one or more control circuits. The one or more control circuits may receive one or more input signals containing host system information and/or data that is used to adjust or set the operating state of at least some of the switches.
(FR) L'invention concerne des composants à semi-conducteur passifs et des commutateurs qui peuvent être formés directement dans, sur, autour ou en travers de chaque puce parmi au moins deux puces de semi-conducteur incluses dans un boîtier de semi-conducteur à puces empilées. Au moins certains des composants à semi-conducteur passifs et/ou des commutateurs peuvent être formés dans des couches de redistribution couplées fonctionnellement à des puces de semi-conducteur correspondantes incluses dans le boîtier de semi-conducteur à puces empilées. Les commutateurs peuvent avoir de multiples états de fonctionnement et peuvent être couplés fonctionnellement aux composants à semi-conducteur passifs de telle sorte qu'un ou plusieurs composants à semi-conducteur passifs puissent être sélectivement inclus dans un ou plusieurs circuits ou exclus d'un ou de plusieurs circuits. Les commutateurs peuvent être commandés manuellement ou commandés de manière autonome à l'aide d'un ou de plusieurs circuits de commande. Le ou les circuits de commande peuvent recevoir un ou plusieurs signaux d'entrée contenant des informations de système hôte et/ou des données qui sont utilisées pour ajuster ou régler l'état de fonctionnement d'au moins certains des commutateurs .
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)