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1. (WO2019066946) MICROELECTRONIC PACKAGE ADHESIVES
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Pub. No.: WO/2019/066946 International Application No.: PCT/US2017/054534
Publication Date: 04.04.2019 International Filing Date: 29.09.2017
IPC:
H01L 25/16 (2006.01) ,H01L 25/18 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/065 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
Applicants:
GAINES, Taylor [US/US]; US
SALTAS, Mark [US/US]; US
RAMALINGAM, Suriyakala Suriya [IN/US]; US
PRAKASH, Anne M. [IN/US]; US
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
GAINES, Taylor; US
SALTAS, Mark; US
RAMALINGAM, Suriyakala Suriya; US
PRAKASH, Anne M.; US
Agent:
WOO, Justin N.; US
ARORA, Suneel / U.S. Reg. No. 42,267; US
BEEKMAN, Marvin / U.S. Reg. No. 38,377; US
BLACK, David W. / U.S. Reg. No. 42,331; US
GOULD, James R. / U.S. Reg. No. 72,086; US
PERDOK, Monique M. / U.S. Reg. No. 42,989; US
SCHEER, Bradley W. / U.S. Reg. No. 47,059; US
Priority Data:
Title (EN) MICROELECTRONIC PACKAGE ADHESIVES
(FR) ADHÉSIFS POUR BOÎTIER MICROÉLECTRONIQUE
Abstract:
(EN) A microelectronic device may include a substrate, a component, and a cured product. The substrate may include a plurality of electrically conductive elements. The component may be coupled to the substrate. The cured product of may couple the substrate and the component, where the cured product may include a resin component and an initiator component, and the resin component and the initiator component may be distributed heterogeneously throughout at least a portion of the cured product with respect to each other.
(FR) L'invention concerne un dispositif microélectronique qui peut comporter un substrat, un composant et un produit durci. Le substrat peut comporter une pluralité d'éléments électroconducteurs. Le composant peut être accouplé au substrat. Le produit durci peut accoupler le substrat et le composant, le produit durci pouvant comporter un composant résine et un composant initiateur, et le composant résine et le composant initiateur pouvant être répartis de manière hétérogène l'un par rapport à l'autre dans au moins une partie du produit durci.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)