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1. (WO2019066924) ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE SUBSTRATES
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What is claimed is:

1. A method of fabricating an RF module package comprising:

fabricating an RF antenna package by layering a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces;

fabricating a base package by plating a core material and building alternating patterned conductive and dielectric layers to create RF links, power links, and a ground plane to connect to the antenna layers; and

bonding a bottom surface of the antenna package to a top surface of the base package to form the RF module package.

2. The method of Claim 1, wherein bonding comprises bonding using a ball grid array between the antenna package and the base package.

3. The method of Claim 2, further comprising applying an array of solder balls to the top surface of the base package, applying an underfill between the solder balls, pressing the antenna package against the base package and reflowing the solder of the solder balls.

4. The method of Claim 3, further comprising patterning a solder stop layer on the bottom surface of the antenna package and on the top surface of the base package before applying the solder balls.

5. The method of Claim 2 or 3, wherein the solder balls are copper core solder balls.

6. The method of any one or more of the above claims, wherein the stack material between the antenna layers has a top and a bottom planar surface to support the antenna layers and wherein the stack material is dielectric to electrically isolate the top and the bottom antenna layers from each other.

7. The method of Claim 6, wherein fabricating an RF antenna package comprises layering a top and bottom antenna layer over a stack material to form multiple antenna plane surfaces and covering the top and bottom antenna layers with a solder stop layer.

8. The method of any one or more of the above claims, wherein fabricating a base package comprises patterning a copper layer over opposite sides of a core material, laminating a dielectric over the patterned copper layers, patterning a second copper layer over both of the dielectric layers and repeating laminating a dielectric and patterning copper to build up multiple patterned copper layers on both sides of the core material.

9. The method of Claim 1, wherein the antenna plane surfaces form a millimeter wave antenna.

10. The method of any one or more of the above claims, further comprising assembling an active die to a bottom side of the base substrate, applying passive components to the base package and connecting the RF module package other modules in an RF system either through a printed circuit board or a cable.

11. An RF module package comprising:

an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces;

a base package having alternating patterned conductive and dielectric layers to form routing through the base package; and

a bond between a bottom surface of the antenna package and to a top surface of the base package.

12. The package of Claim 11, wherein the bond comprises a ball grid array between the antenna package and the base package.

13. The package of Claim 12, wherein the ball grid array comprises an array of reflowed solder balls on the top surface of the base package and an underfill between the solder balls.

14. The package of Claim 13, further comprising a patterned solder stop layer on the bottom surface of the antenna package and on the top surface of the base package between the solder balls.

15. The package of Claim 12, wherein the solder balls are copper core solder balls.

16. The package of any one or more of claims 11-14, wherein the stack material between the antenna layers has a top and a bottom planar surface to support the antenna layers and wherein the stack material is dielectric to electrically isolate the top and the bottom antenna layers from each other.

17. The package of any one or more of claims 11-16, wherein the antenna plane surfaces form a millimeter wave antenna.

18. The package of any one or more of claims 11-17, further comprising an active die assembled to a bottom side of the base substrate, passive components applied to the base package and a connection to other modules in an RF system.

19. A computing system comprising:

a system board;

a processor attached to the system board; and

an RF module package attached to the system board and coupled to the processor through the system board, the RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing

through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.

20. The system of Claim 19, wherein the bond comprises a ball grid array between the antenna package and the base package having an array of reflowed solder balls on the top surface of the base package and an underfill between the solder balls.

21. The system of Claim 19 or 20, wherein the stack material between the antenna layers has a top and a bottom planar surface to support the antenna layers and wherein the stack material is dielectric to electrically isolate the top and the bottom antenna layers from each other.