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1. (WO2019066924) ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE SUBSTRATES
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/066924 International Application No.: PCT/US2017/054395
Publication Date: 04.04.2019 International Filing Date: 29.09.2017
IPC:
H01Q 9/04 (2006.01) ,H01Q 1/38 (2006.01) ,H01Q 1/22 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
9
Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
04
Resonant aerials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
36
Structural form of radiating elements, e.g. cone, spiral, umbrella
38
formed by a conductive layer on an insulating support
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
YAO, Jimin [US/US]; US
LIFF, Shawna M. [US/US]; US
LAMBERT, William J. [US/US]; US
ZHANG, Zhichao [US/US]; US
SANKMAN, Robert L. [US/US]; US
CHAVALI, Sri Chaitra J. [US/US]; US
Inventors:
YAO, Jimin; US
LIFF, Shawna M.; US
LAMBERT, William J.; US
ZHANG, Zhichao; US
SANKMAN, Robert L.; US
CHAVALI, Sri Chaitra J.; US
Agent:
LINDEEN, Gordon R.; US
MALLIE, Michael; US
VINCENT, Lester; US
Priority Data:
Title (EN) ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE SUBSTRATES
(FR) BOÎTIER D'ANTENNE UTILISANT UN RÉSEAU DE FIXATION À BILLES POUR CONNECTER UNE ANTENNE ET DES SUBSTRATS DE BASE
Abstract:
(EN) In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.
(FR) Des modes de réalisation de l'invention concernent un boîtier d'antenne utilisant un réseau de fixation à billes pour connecter une antenne et des substrats de base du boîtier. Un exemple est un boîtier de module RF comprenant un boîtier d'antenne RF ayant un matériau d'empilement entre une couche d'antenne supérieure et une couche d'antenne inférieure pour former de multiples surfaces de plan d'antenne, un boîtier de base ayant des couches conductrices et diélectriques à motifs alternés pour former un routage à travers le boîtier de base, et une liaison entre une surface inférieure du boîtier d'antenne et une surface supérieure du boîtier de base.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)