Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019066909) HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/066909 International Application No.: PCT/US2017/054359
Publication Date: 04.04.2019 International Filing Date: 29.09.2017
IPC:
H01L 25/065 (2006.01) ,H01L 23/00 (2006.01) ,H01L 23/498 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Blvd. Santa Clara, California 95054, US
Inventors:
SHARAN, Sujit; US
AYGUN, Kemal; US
QIAN, Zhiguo; US
MEKONNEN, Yidnekachew; US
ZHANG, Zhichao; US
XIE, Jianyong; US
Agent:
ORTIZ, Kathy, J.; US
Priority Data:
Title (EN) HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
(FR) TRANSLATION DE PAS HORIZONTAL À L'AIDE DE PUCES EN PONT INTÉGRÉS
Abstract:
(EN) Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, wherein the die comprises a plurality of high density features. An interconnect bridge is embedded in the substrate, wherein the interconnect bridge may comprise a first region disposed on a surface of the interconnect bridge comprising a first plurality of features, wherein the first plurality of features comprises a first pitch. A second region disposed on the surface of the interconnect bridge comprises a second plurality of features comprising a second pitch, wherein the second pitch is greater than the first pitch.
(FR) La présente invention concerne des procédés/structures de jonction de structures de boîtier. Ces procédés/structures peuvent comprendre une puce disposée sur une surface d'un substrat, la puce comprenant une pluralité de caractéristiques de haute densité. Un pont d'interconnexion est intégré dans le substrat, le pont d'interconnexion pouvant comprendre une première région disposée sur une surface du pont d'interconnexion comprenant une première pluralité de caractéristiques, la première pluralité de caractéristiques comprenant un premier pas. Une seconde région disposée sur la surface du pont d'interconnexion comprend une seconde pluralité de caractéristiques comprenant un second pas, le second pas étant supérieur au premier pas.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)