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1. (WO2019066869) CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT
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Pub. No.: WO/2019/066869 International Application No.: PCT/US2017/054103
Publication Date: 04.04.2019 International Filing Date: 28.09.2017
IPC:
G02B 6/12 (2006.01) ,G02B 6/42 (2006.01) ,G02B 6/43 (2006.01)
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10
of the optical waveguide type
12
of the integrated circuit kind
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24
Coupling light guides
42
Coupling light guides with opto-electronic elements
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24
Coupling light guides
42
Coupling light guides with opto-electronic elements
43
Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
KIM, Sang Yup; US
YIM, Myung Jin; US
KIM, Woosung; US
Agent:
WOO, Justin N.; US
ARORA, Suneel / U.S. Reg. No. 42,267; US
BEEKMAN, Marvin / U.S. Reg. No. 38,377; US
BLACK, David W. / U.S. Reg. No. 42,331; US
GOULD, James R. / U.S. Reg. No. 72,086; US
PERDOK, Monique M. / U.S. Reg. No. 42,989; US
SCHEER, Bradley W. / U.S. Reg. No. 47,059; US
Priority Data:
Title (EN) CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT
(FR) CONDITIONNEMENT COMMUN À L'AIDE D'UN CIRCUIT D'ONDE LUMINEUSE PLANAIRE HYBRIDE PHOTONIQUE AU SILICIUM
Abstract:
(EN) An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.
(FR) La présente invention concerne un appareil interposeur destiné à conditionner ensemble un circuit intégré électronique et un circuit intégré photonique et pouvant comprendre : un substrat diélectrique ; un guide d'ondes optique disposé sur le substrat diélectrique pour coupler optiquement le circuit intégré photonique disposé sur un côté du substrat diélectrique avec au moins un autre circuit intégré photonique disposé sur le substrat diélectrique ou un dispositif optique disposé sur le substrat diélectrique ; et une interconnexion métallique traversant le substrat diélectrique pour coupler électriquement le circuit intégré photonique disposé sur un côté du substrat diélectrique avec un circuit intégré électronique disposé sur l'autre côté du substrat diélectrique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)