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1. (WO2019066830) FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES
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Pub. No.: WO/2019/066830 International Application No.: PCT/US2017/053853
Publication Date: 04.04.2019 International Filing Date: 28.09.2017
IPC:
H01L 21/768 (2006.01) ,H01L 21/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054-1549, US
Inventors:
MAYS, Ebony L.; US
TUFTS, Bruce J.; US
Agent:
HARTMANN, Natalya; US
Priority Data:
Title (EN) FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES
(FR) REMPLISSAGE D'OUVERTURES PAR COMBINAISON DE PROCESSUS FLUIDES ET NON FLUIDES
Abstract:
(EN) Disclosed herein are methods for manufacturing IC components using bottom-up fill of openings with a dielectric material. In one aspect, an exemplary method includes, first, depositing a solid dielectric liner on the inner surfaces of the openings using a non-flowable process, and subsequently filling the remaining empty volume of the openings with a fill dielectric using a flowable process. Such a combination method may maximize the individual strengths of the non-flowable and flowable processes due to the synergetic effect achieved by their combined use, while reducing their respective drawbacks. Assemblies and devices manufactured using such methods are disclosed as well.
(FR) L'invention concerne des procédés de fabrication de composants de circuit intégré à l'aide d'un remplissage de bas en haut d'ouvertures avec un matériau diélectrique. Selon un aspect, un procédé donné à titre d'exemple comprend, en premier lieu, le dépôt d'un revêtement diélectrique solide sur les surfaces internes des ouvertures à l'aide d'un processus non fluide, et ensuite le remplissage du volume vide restant des ouvertures avec un diélectrique de remplissage à l'aide d'un processus fluide. Un tel procédé de combinaison peut maximiser les forces individuelles des processus non fluides et fluides en raison de l'effet synergique obtenu par leur utilisation combinée, tout en réduisant leurs inconvénients respectifs. L'invention concerne également des assemblages et des dispositifs fabriqués à l'aide de tels procédés.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)