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1. (WO2019066825) PASSIVATION LAYER FOR GERMANIUM SUBSTRATE
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Pub. No.: WO/2019/066825 International Application No.: PCT/US2017/053843
Publication Date: 04.04.2019 International Filing Date: 27.09.2017
IPC:
H01L 21/02 (2006.01) ,H01L 29/78 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29
Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
66
Types of semiconductor device
68
controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified, or switched
76
Unipolar devices
772
Field-effect transistors
78
with field effect produced by an insulated gate
Applicants:
ROMERO, Patricio E. [CL/US]; US
CLENDENNING, Scott B. [US/US]; US
GSTREIN, Florian [AT/US]; US
TAN, Cen [US/US]; US
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
ROMERO, Patricio E.; US
CLENDENNING, Scott B.; US
GSTREIN, Florian; US
TAN, Cen; US
Agent:
WANG, Yuke; US
PUGH, Joseph A.; US
COFIELD, Michael A.; US
BLANK, Eric S.; US
ROJO, Estiven; US
BRASK, Justin K.; US
AUYEUNG, Al; US
BERNADICOU, Michael A.; US
BLAIR, Steven R.; US
DANSKIN, Timothy A.; US
HALEVA, Aaron S.; US
MAKI, Nathan R.; US
MARLINK, Jeffrey S.; US
MOORE, Michael S.; US
PARKER, Wesley E.; US
RASKIN, Vladimir; US
STRAUSS, Ryan N.; US
YATES, Steven D.; US
SULLIVAN, Stephen G.; US
Priority Data:
Title (EN) PASSIVATION LAYER FOR GERMANIUM SUBSTRATE
(FR) COUCHE DE PASSIVATION POUR SUBSTRAT EN GERMANIUM
Abstract:
(EN) Embodiments herein describe techniques for a semiconductor device including a Ge substrate. A passivation layer may be formed above the Ge substrate, where the passivation layer may include one or more molecular monolayers with atoms of one or more group 15 elements or group 16 elements. In addition, a low-k interlayer may be above the passivation layer, and a high-k interlayer may be above the low-k interlayer. Furthermore, a metal contact may be above the high-k interlayer. Other embodiments may be described and/or claimed.
(FR) Dans des modes de réalisation, la présente invention concerne des techniques pour un dispositif semi-conducteur comprenant un substrat en Ge. Une couche de passivation peut être formée au-dessus du substrat en Ge, la couche de passivation pouvant comprendre une ou plusieurs monocouches moléculaires comportant des atomes d'un ou plusieurs éléments du groupe 15 ou du groupe 16. De plus, une couche intermédiaire à faible k peut être disposée au-dessus de la couche de passivation, et une couche intermédiaire à k élevé peut être disposée au-dessus de la couche intermédiaire à faible k. En outre, un contact métallique peut être disposé au-dessus de la couche intermédiaire à k élevé. D'autres modes de réalisation peuvent être décrits et/ou revendiqués.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)