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1. (WO2019066814) BONDING PROCESS USING REACTIONS BETWEEN MONOLAYERS
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Pub. No.: WO/2019/066814 International Application No.: PCT/US2017/053787
Publication Date: 04.04.2019 International Filing Date: 27.09.2017
IPC:
B32B 7/10 (2006.01) ,B32B 7/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
04
characterised by the connection of layers
10
one or both of the layers having adhesive or inter-reactive properties
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Blvd. Santa Clara, California 95054, US
Inventors:
STRONG, Veronica; US
ALEKSOV, Aleksandar; US
MAESTRE CARO, Aranzazu; US
ELSHERBINI, Adel; US
Agent:
MILLER, Dermot G.; US
Priority Data:
Title (EN) BONDING PROCESS USING REACTIONS BETWEEN MONOLAYERS
(FR) PROCÉDÉ DE LIAISON UTILISANT DES RÉACTIONS ENTRE DES MONOCOUCHES
Abstract:
(EN) Techniques and mechanisms for bonding layers of a substrate using a monolayer of a compound. In an embodiment, a first monolayer of first molecules is disposed on one of a dielectric layer and a metallization layer, wherein a second monolayer of second molecules is disposed on another dielectric layer. An addition reaction between the first monolayer and the second monolayer produces a first adduct which forms a third monolayer to bond respective surface portions with each other. In another embodiment, a third monolayer of third molecules is disposed on one of the dielectric layer and the metallization layer, wherein a fourth monolayer of fourth molecules is also disposed on the other dielectric layer. A second addition reaction between the third monolayer and the fourth monolayer produces a second adduct which forms another monolayer to further bond respective surface portions with each other.
(FR) L'invention concerne des techniques et des mécanismes pour lier des couches d'un substrat à l'aide d'une monocouche d'un composé. Dans un mode de réalisation, une première monocouche de premières molécules est disposée sur une couche parmi une couche diélectrique et une couche de métallisation, une deuxième monocouche de troisièmes molécules étant disposée sur une autre couche diélectrique. Une réaction d'addition entre la première monocouche et la deuxième monocouche produit un premier adduit qui forme une troisième monocouche pour lier des parties de surface respectives les unes aux autres. Dans un autre mode de réalisation, une troisième monocouche de troisièmes molécules est disposée sur une couche parmi la couche diélectrique et la couche de métallisation, une quatrième monocouche de quatrièmes molécules étant également disposée sur l'autre couche diélectrique. Une seconde réaction d'addition entre la troisième monocouche et la quatrième monocouche produit un second adduit qui forme une autre monocouche pour lier davantage les parties de surface respectives les unes aux autres.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)