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1. (WO2019066801) INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL
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Pub. No.: WO/2019/066801 International Application No.: PCT/US2017/053694
Publication Date: 04.04.2019 International Filing Date: 27.09.2017
IPC:
H01L 23/373 (2006.01) ,H01L 23/367 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054-1549, US
Inventors:
YAZZIE, Kyle; US
YAGNAMURTHY, Naga Sivakumar; US
MALATKAR, Pramod; US
CHIU, Chia-Pin; US
MAMODIA, Mohit; US
GALLINA, Mark J.; US
NEERUKATTI, Rajesh Kumar; US
BAUTISTA, Joseph; US
DRAKE, Michael Gregory; US
Agent:
MASSIE FEUSTEL, Alisha; US
Priority Data:
Title (EN) INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL
(FR) BOÎTIERS DE CIRCUIT INTÉGRÉ AVEC MATÉRIAU PROTECTEUR À MOTIFS
Abstract:
(EN) Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.
(FR) L'invention concerne des boîtiers de circuit intégré (CI) avec un composant électronique ayant un matériau protecteur à motifs sur une face, ainsi que des dispositifs et des procédés associés. Selon certains modes de réalisation, un dispositif informatique peut comprendre : un boîtier de circuit intégré (CI) avec un composant électronique ayant un matériau protecteur sur la face arrière du composant électronique, le matériau protecteur étant configuré pour comprendre une zone sur la face arrière du composant électronique qui n'est pas recouverte par le matériau protecteur ; une carte de circuit imprimé, le boîtier CI étant électriquement couplé à la carte de circuit imprimé ; et un dissipateur thermique, le dissipateur thermique étant fixé à la carte de circuit imprimé et en contact thermique avec la zone sur la face arrière du composant électronique qui n'est pas recouverte par le matériau protecteur.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)