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1. (WO2019066783) Layered RFID Tag
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Pub. No.: WO/2019/066783 International Application No.: PCT/US2017/053512
Publication Date: 04.04.2019 International Filing Date: 26.09.2017
IPC:
G06K 19/067 (2006.01) ,H05K 3/00 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US/US]; 10300 Energy Drive Spring, Texas 77389, US
Inventors:
GE, Ning; US
PEDERSON, Douglas; US
SILVEIRA, Roberto Pereira; BR
LONESCU, Robert; US
WITTKOPF, Jarrid; US
HOLDER, Helen A; US
Agent:
BURROWS, Sarah; US
FOR ADDITIONAL NAMES, Please See attached General Power of Attorney; US
Priority Data:
Title (EN) Layered RFID Tag
(FR) ÉTIQUETTE RFID STRATIFIÉE
Abstract:
(EN) Examples disclosed herein relate to a layered RFID tag. In one implementation, a layered passive chipless RFID tag includes a first conductive layer, a second dielectric layer, and a third conductive layer. The first, second, and third layers may be in a stacked configuration with the second layer between the first layer and the second layer.
(FR) Des exemples de la présente invention concernent une étiquette RFID stratifiée. Dans un mode de réalisation, une étiquette RFID sans puce passive stratifiée comprend une première couche conductrice, une deuxième couche diélectrique et une troisième couche conductrice. Les première, deuxième et troisième couches peuvent être dans une configuration empilée avec la deuxième couche entre la première couche et la deuxième couche.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)