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1. (WO2019066722) SYSTEM AND METHOD FOR MOUNTING A FLIP CHIP
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/066722 International Application No.: PCT/SG2018/050465
Publication Date: 04.04.2019 International Filing Date: 12.09.2018
IPC:
H01L 21/00 (2006.01) ,B25J 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
B PERFORMING OPERATIONS; TRANSPORTING
25
HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
J
MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
9
Programme-controlled manipulators
Applicants:
ROKKO SYSTEMS PTE LTD [SG/SG]; 61 Kaki Bukit Road 2, Singapore 417869, SG
Inventors:
JUNG, Jong Jae; SG
SHIN, Yuk Suk; SG
JANG, Deok Chun; SG
Agent:
ENGLISH, Matthew; SG
Priority Data:
10201708010Q28.09.2017SG
Title (EN) SYSTEM AND METHOD FOR MOUNTING A FLIP CHIP
(FR) SYSTÈME ET PROCÉDÉ DE MONTAGE DE PUCE RETOURNÉE
Abstract:
(EN) A system for mounting a flip chip, comprising: at least one flipper arm, having an engagement end; said flipper arm arranged to rotate in a vertical plane; said engagement end arranged to engage a chip and, on engagement, rotate 180⁰.
(FR) L'invention concerne un système de montage d'une puce retournée comprenant : au moins un bras , ayant une extrémité de mise en prise; ledit bras éjecteur étant conçu pour tourner dans un plan vertical ; ladite extrémité de mise en prise étant conçue pour venir en prise avec une puce et, lors de la mise en prise, tourner de 180°.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)