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1. (WO2019066597) PRINTED CIRCUIT BOARD AND DEVICE COMPRISING SAME PRINTED CIRCUIT BOARD
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Pub. No.: WO/2019/066597 International Application No.: PCT/KR2018/011603
Publication Date: 04.04.2019 International Filing Date: 28.09.2018
IPC:
H05K 1/11 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
삼성전자주식회사 SAMSUNG ELECTRONICS CO., LTD. [KR/KR]; 경기도 수원시 영통구 삼성로 129 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 16677, KR
Inventors:
조용희 CHO, Yong Hee; KR
Agent:
특허법인 세림 SELIM INTELLECTUAL PROPERTY LAW FIRM; 서울시 서초구 강남대로 285 태우빌딩 10층,11층 10F and 11F, Taewoo Bldg. 285, Gangnam-daero Seocho-gu Seoul 06729, KR
Priority Data:
10-2017-012699229.09.2017KR
Title (EN) PRINTED CIRCUIT BOARD AND DEVICE COMPRISING SAME PRINTED CIRCUIT BOARD
(FR) CARTE DE CIRCUIT IMPRIMÉ ET DISPOSITIF COMPRENANT CETTE CARTE DE CIRCUIT IMPRIMÉ
(KO) 인쇄 회로 기판 및 상기 인쇄 회로 기판을 포함하는 장치
Abstract:
(EN) The present invention relates to a printed circuit board and a device comprising the printed circuit board. The printed circuit board may comprise: a first layer in which a first signal transmission path is formed; a second layer which is disposed in the direction of one side of the first layer and includes a first ground providing a return current path for a signal transmitted from the first layer; a third layer in which a second signal transmission path is formed; and a fourth layer which is disposed in the direction of the side of the third layer, corresponding to the other side of the first layer, and includes a second ground providing a return current path for a signal transmitted from the third layer.
(FR) La présente invention concerne une carte de circuit imprimé et un dispositif comprenant la carte de circuit imprimé. La carte de circuit imprimé peut comprendre : une première couche dans laquelle est formé un premier chemin de transmission de signal ; une deuxième couche qui est disposée dans la direction d'un côté de la première couche et comprend une première masse fournissant un chemin de retour de courant pour un signal transmis à partir de la première couche ; une troisième couche dans laquelle est formé un deuxième chemin de transmission de signal ; et une quatrième couche qui est disposée dans la direction du côté de la troisième couche, correspondant à l'autre côté de la première couche, et comprend une deuxième masse fournissant un chemin de retour de courant pour un signal transmis à partir de la troisième couche.
(KO) 인쇄 회로 기판 및 상기 인쇄 회로 기판을 포함하는 장치에 관한 것으로, 인쇄 회로 기판은, 제1 신호 전달 경로가 형성된 제1 층, 상기 제1 층의 일 면 방향에 배치되고, 상기 제1 층에서 전달되는 신호에 대한 귀환 전류 경로(Return Current Path)를 제공하는 제1 접지를 포함하는 제2 층, 제2 신호 전달 경로가 형성된 제3 층 및 상기 제3 층의 타 면 방향에 배치되고, 상기 제3 층에서 전달되는 신호에 대한 귀환 전류 경로를 제공하는 제2 접지를 포함하는 제4 층을 포함할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)