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1. (WO2019066351) PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
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Pub. No.: WO/2019/066351 International Application No.: PCT/KR2018/010973
Publication Date: 04.04.2019 International Filing Date: 18.09.2018
IPC:
H05K 3/06 (2006.01) ,H05K 3/26 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
26
Cleaning or polishing of the conductive pattern
Applicants:
엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
정희영 CHUNG, Hee Young; KR
박재만 PARK, Jae Man; KR
김무성 KIM, Moo Seong; KR
Agent:
특허법인 다나 DANA PATENT LAW FIRM; 서울시 강남구 역삼로3길 11 광성빌딩 신관4~6층 4~6th Floor, New Wing, Gwangsung Bldg. 11, Yeoksam-ro 3-gil Gangnam-gu Seoul 06242, KR
Priority Data:
10-2017-012815229.09.2017KR
Title (EN) PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
(FR) CARTE DE CIRCUIT IMPRIMÉ ET SON PROCÉDÉ DE FABRICATION
(KO) 인쇄회로기판 및 그의 제조방법
Abstract:
(EN) A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.
(FR) Selon un mode de réalisation de la présente invention, une carte de circuit imprimé comprend une carte d'isolation et une pluralité d'électrodes métalliques disposées sur la carte d'isolation, la pluralité d'électrodes métalliques comprenant une première électrode et une seconde électrode ; la première électrode comprenant une première surface parallèle à une surface supérieure de la carte d'isolation, une seconde surface faisant face à la première surface, une première surface latérale disposée entre la première surface et la seconde surface, et une seconde surface latérale faisant face à la première surface latérale ; une partie de la première surface latérale et une partie de la seconde surface latérale faisant saillie vers l'extérieur de la première électrode dans la direction parallèle à la surface supérieure de la carte d'isolation ; la première surface latérale faisant saillie plus loin dans une zone adjacente à la première surface que dans une zone adjacente à la seconde surface ; et la seconde surface latérale faisant saillie plus loin dans la zone adjacente à la seconde surface que dans la zone adjacente à la première surface.
(KO) 본 발명의 한 실시예에 따른 인쇄회로기판은 절연기판, 그리고 상기 절연기판 상에 배치되는 복수의 금속전극을 포함하고, 상기 복수의 금속전극은 제1 전극 및 제2 전극을 포함하며, 상기 제1 전극은, 상기 절연기판의 상면과 평행한 제1 면, 상기 제1 면과 대향하는 제2 면, 상기 제1 면과 상기 제2 면 사이에 배치되는 제1 측면, 그리고 상기 제1 측면과 대향하는 제2 측면을 포함하고, 상기 제1 측면의 일부 및 상기 제2 측면의 일부는 상기 제1 전극의 외부를 향하여 상기 절연기판의 상면과 평행한 방향으로 돌출되며, 상기 제1 측면은 상기 제2 면과 인접한 영역에서보다 상기 제1 면과 인접한 영역에서 더 돌출되고, 상기 제2 측면은 상기 제1 면과 인접한 영역에서보다 상기 제2 면과 인접한 영역에서 더 돌출된다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)