Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019066246) BINDER RESIN, COLORED PHOTOSENSITIVE RESIN COMPOSITION, DISPLAY PARTITION STRUCTURE INCLUDING SAME, AND SELF-LIGHT-EMITTING DISPLAY DEVICE INCLUDING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/066246 International Application No.: PCT/KR2018/009208
Publication Date: 04.04.2019 International Filing Date: 10.08.2018
IPC:
G03F 7/033 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01) ,G03F 7/031 (2006.01) ,G03F 7/105 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032
with binders
033
the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028
with photosensitivity-increasing substances, e.g. photoinitiators
031
Organic compounds not covered by group G03F7/02967
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
09
characterised by structural details, e.g. supports, auxiliary layers
105
having substances, e.g. indicators, for forming visible images
Applicants:
동우 화인켐 주식회사 DONGWOO FINE-CHEM CO., LTD. [KR/KR]; 전라북도 익산시 약촌로 132 132, Yakchon-ro Iksan-si, Jeollabuk-do 54631, KR
Inventors:
김훈식 KIM, Hun-Sik; KR
이종수 LEE, Jong-Soo; KR
최한영 CHOI, Han-Young; KR
Agent:
한양특허법인 HANYANG PATENT FIRM; 서울시 강남구 논현로38길 12, 한양빌딩 Hanyang building, 12, Nonhyeonro 38-gil, Gangnam-gu Seoul 06296, KR
Priority Data:
10-2017-012771929.09.2017KR
Title (EN) BINDER RESIN, COLORED PHOTOSENSITIVE RESIN COMPOSITION, DISPLAY PARTITION STRUCTURE INCLUDING SAME, AND SELF-LIGHT-EMITTING DISPLAY DEVICE INCLUDING SAME
(FR) RÉSINE LIANTE, COMPOSITION DE RÉSINE PHOTOSENSIBLE COLORÉE, STRUCTURE DE PARTITION D'AFFICHAGE COMPRENANT CELLE-CI, ET DISPOSITIF D'AFFICHAGE ÉLECTROLUMINESCENT L'INCLUANT
(KO) 바인더 수지, 착색 감광성 수지 조성물, 이를 포함하는 디스플레이 격벽 구조물 및 이를 포함하는 자발광 표시장치
Abstract:
(EN) The present invention relates to: a binder resin represented by chemical formula I; a colored photosensitive resin composition including the binder resin, a colorant, a photopolymerizable monomer, an oxime-based photoinitiator, and a solvent; a display partition structure including same; and a self-light-emitting display device.
(FR) La présente invention concerne : une résine liante représentée par la formule chimique I ; une composition de résine photosensible colorée comprenant la résine liante, un colorant, un monomère photopolymérisable, un photoinitiateur à base d'oxime et un solvant ; une structure de partition d'affichage comprenant celle-ci ; et un dispositif d'affichage électroluminescent.
(KO) 본 발명은 화학식 I로 표시되는 바인더수지 및 상기 바인더수지와 착색제, 광중합성 단량체, 옥심계 광 개시제 및 용매를 포함하는 착색 감광성 수지 조성물, 이를 포함하는 디스플레이 격벽 구조물 및 자발광 표시장치에 관한 것이다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)